Transfer Module Aligners for Serial Substrate Processing

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Solution Overview

Problem

Existing substrate processing systems face challenges in maintaining high productivity when aligning substrates for serial transfer and processing in multiple process modules, particularly due to complex alignment processes that complicate substrate transfer.

Innovation Solution

The system incorporates aligners within transfer modules to align substrates before transferring them to process modules, minimizing the need for external alignment and optimizing the transfer path to improve efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If substrates are aligned in an atmospheric transfer chamber before serial transfer to process modules, then pre-alignment is achieved, but the alignment process complicates substrate transfer and reduces productivity

Engineering Contradiction:

Improvesubstrate alignment precisionVSAvoidsubstrate processing productivity

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The system divides the alignment function into separate aligners integrated with each transfer module, rather than performing alignment in a centralized atmospheric transfer chamber. This segmentation allows alignment to occur locally at each transfer point without complicating the overall transfer process, maintaining both alignment precision and productivity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Alignment is performed as a preliminary action within each transfer module before substrate transfer to the next process module. This preliminary alignment at the transfer point eliminates the need for complex post-transfer alignment operations, thereby maintaining high productivity while ensuring alignment precision

Inventive Principle:

Principle #10Preliminary action

2Measurement precision

If multiple aligners are integrated into transfer modules for serial substrate transfer, then alignment is performed at each transfer point, but device complexity increases

Engineering Contradiction:

Improvesubstrate alignment precisionVSAvoidtransfer module complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The aligner is merged with the transfer module as an integrated unit, combining the substrate transfer function and alignment function in a single module. This merging reduces overall system complexity by eliminating separate alignment stations while maintaining alignment precision at each transfer point

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Each transfer module is designed with multi-functionality, serving both as a substrate transfer mechanism and an alignment device. This universality reduces the total number of components needed in the system, thereby reducing device complexity while maintaining the capability to align substrates at each transfer point

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12435410B2Substrate processing system and substrate processing method

Publication Date: 2025.10.07 TOKYO ELECTRON LTD

AI summary

There is provided a substrate processing system comprising: a plurality of transfer modules having transfer mechanisms configured to transfer substrates; and a plurality of process modules connected to the plurality of transfer modules. The transfer mechanisms of the plurality of transfer modules transfer a plurality of substrates sequentially and serially to the plurality of process modules, and each of the plurality of transfer modules has an aligner configured to align a substrate when transferring the substrate to the process module connected to a relevant transfer module.