Transfer Pin Solder Application for 3D MID Boards
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Solution Overview
Problem
The challenge is to stably apply solder to the mounting surface of a three-dimensional molded interconnect device (MID) with varying shapes, as elongating the dispense nozzle can lead to clogging due to the high viscosity of the solder, making it difficult to achieve consistent application.
Innovation Solution
A component mounting machine with a transfer material supply unit that spreads the solder into a film on a transfer table, a transfer pin to transfer the solder to the mounting surface, and a control device to manage the transfer pin's operation, ensuring stable transfer even with elongated pins that avoid interference with the three-dimensional board shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the dispense nozzle is elongated to avoid interference with three-dimensional board shapes, then the applicability to various MID shapes is improved, but the transfer material is likely to be clogged in the dispense nozzle
Solution Approach 1:
The patent introduces a transfer table as an intermediary medium between the dispense nozzle and the MID mounting surface. The transfer table receives the transfer material in a film shape and the transfer pin picks up the material from this film, allowing the dispense nozzle to remain short while still being able to reach various MID shapes. This mediator resolves the contradiction by decoupling the nozzle length requirement from the reach requirement.
Solution Approach 2:
The transfer process is segmented into distinct functional components: the dispense nozzle for material discharge, the transfer table for material distribution, and the transfer pin for precise pickup and transfer. This segmentation allows each component to be optimized independently - the nozzle remains short to prevent clogging while the transfer table and pin system provides the necessary reach and precision for various MID geometries.
2Manufacturing precision
If the dispense nozzle is made thin to apply solder to fine electrodes, then the precision of solder application is improved, but the transfer material is more likely to be clogged when elongated
Solution Approach 1:
The transfer table serves as a mediator that allows the thin dispense nozzle to deliver solder to fine electrodes without requiring the nozzle itself to be elongated. The nozzle remains short and thin for precision work, while the transfer table and pin system provides the extended reach needed to access fine electrodes on three-dimensional MID structures.
Solution Approach 2:
The patent extracts the material transfer function from the dispense nozzle itself and relocates it to a separate transfer pin system. This allows the nozzle to be optimized for precision (thin diameter) while the transfer pin, which can be longer, handles the actual transfer to the electrode, eliminating the clogging problem associated with elongated thin nozzles.
3Ease of operation
If a screen printing method is used to apply solder, then the ease of application is improved, but the method cannot be used on three-dimensional boards with varying heights and inclined surfaces
Solution Approach 1:
The patent replaces the mechanical screen printing system with a dispense nozzle-based application system. The screen printing method, which relies on a flat bed and mechanical screen, cannot accommodate three-dimensional MID surfaces. The dispense nozzle system, combined with the transfer table and pin mechanism, provides adaptability to various three-dimensional geometries while maintaining ease of operation through automated material delivery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for stable transfer of solder to the mounting surface of three-dimensional boards with various shapes, preventing clogging and ensuring consistent application, even when the transfer pin is elongated to avoid interference with the board's shape.
Implementation Method 1
a transfer material supply unit configured to supply a transfer material on a transfer table and spread the transfer material in a film shape on the transfer table
Implementation Method 2
attaching the transfer material to the lower end of the transfer pin, and transferring the transfer material to the mounting surface
Data Source
AI summary
Transfer material supply units for supplying a transfer material to a transfer table and spreading the transfer material is set in a component mounting machine, and transfer pins for transferring the transfer material to a mounting surface of a three-dimensional board are held by at least one mounting head of the component mounting machine to be exchangeable with a suction nozzle for picking up a circuit component. The lower end of the transfer pin is immersed in the transfer material on the transfer table to attach the transfer material to the lower end of the transfer pin by moving the mounting head holding the transfer pin to a position above the transfer table to lower and raise the transfer pin, and then the transfer material attached to the lower end of the transfer pin is transferred to the mounting surface.