Transfer Apparatus Plasma Mold Cleaning

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Solution Overview

Problem

Conventional transfer apparatuses for fine transfer patterns on molds to resin-coated substrates face issues with mold releasing property deterioration and pattern shape degradation when repeatedly used, due to adhered substances and dust.

Innovation Solution

A transfer apparatus incorporating a plasma unit to clean the mold after each transfer, adjusting plasma irradiation dose based on usage frequency, and a system for winding and unwinding the mold to ensure continuous use without compromising pattern quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the mold is repeatedly used several times for transfer, then productivity is improved, but the releasing property of the mold deteriorates and the shape of the transferred pattern degrades

Engineering Contradiction:

Improvenumber of times the mold can be reusedVSAvoidreleasing property of the mold

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The plasma unit performs preliminary cleaning action on the mold surface between transfers to prevent accumulation of adhered substances and dust that would otherwise deteriorate releasing property and pattern shape over repeated use

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces mechanical cleaning methods with plasma cleaning technology, using ionized gas to chemically clean the mold surface without physical contact, thereby maintaining mold integrity and releasing property over multiple uses

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If the mold is repeatedly used several times for transfer, then productivity is improved, but the shape of the transferred pattern deteriorates

Engineering Contradiction:

Improvenumber of times the mold can be reusedVSAvoidshape of the transferred pattern

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The plasma unit performs preliminary cleaning action on the mold surface between transfers to prevent accumulation of fine dusts and adhered substances that would otherwise distort the fine transfer pattern shape over repeated use

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses plasma cleaning instead of mechanical cleaning to maintain the fine transfer pattern shape on the mold surface, as plasma cleaning does not physically contact or damage the delicate pattern features

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents mold releasing property deterioration and maintains pattern shape integrity even after multiple uses by effectively cleaning the mold with plasma and managing mold usage through controlled winding and unwinding processes.

Implementation Method 1

a plasma unit configured to irradiate plasma to the mold peeled off from the resin after the transfer pattern formed on the mold is transferred to the resin coated on the substrate, thereby cleaning the mold

Methodology Applied

Scientific EffectPlasma: Plasma

Data Source

PatentUS11801629B2Transfer apparatus

Publication Date: 2023.10.31 SHIBAURA MASCH CO LTD

AI summary

According to one embodiment, a transfer apparatus includes a coating part for coating an uncured resin on a substrate, a substrate installation part for positioning and installing the substrate integrally, a mold installation part for installing a sheet-like mold, a transfer roller for transferring a fine transfer pattern formed on the mold to the resin coated on the substrate, and a plasma unit for cleaning the mold by irradiating plasma to the mold peeled off from the resin after transferring. After cleaning by the plasma using the plasma unit, the cleaned mold is used again for transferring of the transfer pattern.