Transfer Print Component Geometry for Faster Underetching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing micro-processing techniques for transferring semiconductor components from a carrier substrate to a new substrate face challenges with increased etching time and costs as the size of components grows, due to the limited effective area for underetching, leading to potential etch process standstill and reduced component size limitations.
Innovation Solution
The introduction of geometrically configured components with lateral openings on the carrier substrate, allowing for a two-sided etching attack and reducing the etching distance, thereby shortening the underetching time and increasing the effective area for etching, which can handle larger components efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the size of components is increased, then the component area and functionality are improved, but the etching time increases and the etching process may stand still
Solution Approach 1:
The patent introduces lateral openings that divide the component structure into multiple etchable sections. The etching process attacks the component from multiple sides simultaneously through these openings, effectively segmenting the etching path and reducing the maximum etching distance required, thereby decreasing overall etching time while maintaining larger component areas
Solution Approach 2:
The patent adds a lateral dimension to the etching approach by creating openings that allow etchant access from horizontal directions rather than only from below. This multi-dimensional etching attack reduces the effective etching distance and time required for larger components
2Area of moving object
If the component size is increased, then the component functionality is improved, but the effective area for underetching is limited
Solution Approach 1:
The lateral openings segment the component structure to create multiple access points for the etchant, effectively increasing the total surface area available for underetching attacks without reducing the overall component footprint or functionality
3Device complexity
If conventional etching processes are used for larger components, then process simplicity is maintained, but etch process standstill occurs
Solution Approach 1:
The lateral openings are created as a preliminary structural feature before the underetching process. This pre-prepared geometry enables the etchant to access and remove material from multiple locations simultaneously, preventing etch process standstill in larger components while maintaining overall process simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces etching time, ensures reliable detachment and transfer of components, and maintains process predictability, enabling the transfer of larger components with existing etching systems while preventing etch process stoppages.
Implementation Method 1
separating the components from the carrier substrate, a layer extending below the components is etched away between the ends of the separation trenches by means of selective lateral etching
Data Source
AI summary
The invention relates to a geometric design and corresponding methods for components 22, which are produced on a carrier substrate 10 and prepared by detachment in an etching process 30 for a subsequent absorption and a transfer with a stamp for application to a further substrate. The components 22 are designed in such a way that additional active surfaces are provided for the etching process 30 for undercut the components, so that a faster, more reliable and more homogeneous etching profile is achieved.