Transfer Printed Component Thermal Coupling via Metallization Integration
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Solution Overview
Problem
Existing methods for transferring semiconductor components to a receiving substrate often fail to ensure efficient electrical and thermal coupling, leading to suboptimal functionality and heat dissipation in integrated circuits.
Innovation Solution
The integration of a second component into the metallization layers of the receiving substrate, with a metal-containing area arranged beneath or adjacent to the component, enables efficient thermal distribution and electrical connection, eliminating the need for additional process steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor components are transferred from a first semiconductor wafer to a second semiconductor wafer by use of a stamp, then components can be transferred with different material types and crystal orientations, but efficient thermal coupling and heat distribution to the receiving substrate is not ensured
Solution Approach 1:
The patent merges the transferred component with the receiving substrate by integrating it into the metallization layers. The component is positioned in a pit that extends through dielectric layers to contact a metal-containing area, creating a unified thermal pathway. This combining of the component with the substrate's metallization structure ensures efficient heat distribution while maintaining transfer printing versatility.
Solution Approach 2:
The patent performs preliminary actions by forming the pit structure and metal-containing area in the receiving substrate before transferring the component. The pit extends through dielectric layers to expose the metal-containing area, and the component is then transferred to sit directly on this pre-prepared thermal pathway, ensuring immediate thermal coupling upon transfer.
2Productivity
If components are transferred by etching free at the sides and beneath with connection elements, then components can be released and transferred, but residues of fractured connection elements remain visible at the sides of the component
Solution Approach 1:
The patent extracts the connection elements completely by etching them away after the component has been transferred and secured. The etching process removes the connection elements from beneath the component, leaving no visible residues on the component sides. This extraction approach maintains transfer printing efficiency while achieving clean component surfaces.
Solution Approach 2:
The patent uses the connection elements as temporary support structures during the transfer process, knowing they will be removed afterward. These elements provide mechanical retention during etching and transfer, cushioning the component against damage, and are subsequently removed to leave a clean surface without residues.
3Productivity
If metallization layers are deposited all over the wafer and then structured in further processing steps, then cost-effective manufacture is enabled through parallel processing, but additional process steps are required after component transfer
Solution Approach 1:
The patent performs preliminary actions by forming the pit structure and metal-containing area in the receiving substrate before transferring the component. This allows metallization layers to be deposited and structured in parallel across the entire wafer beforehand, reducing post-transfer processing steps while maintaining cost-effective manufacturing.
Solution Approach 2:
The patent applies local quality by creating a specific pit structure at the component location that extends through dielectric layers to contact the metal-containing area. This localized structure allows the component to be integrated into the metallization layers without requiring additional wafer-wide processing steps, maintaining parallel processing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures effective heat distribution and electrical insulation, allowing high-current and high-switching-rate transistors to efficiently dissipate thermal losses across a large area of the substrate, while maintaining a planar surface for further processing.
Implementation Method 1
A part of the components is brought into conformal contact with the surface of the stamp and released from the first semiconductor wafer by adhesion to the stamp
Implementation Method 2
a metal-containing area arranged beneath or adjacent to the component, enables efficient thermal distribution
Data Source
AI summary
A component to be transferred to a receiving substrate is to be coupled both electrically and thermally. This is achieved by an integrated circuit comprising a substrate and a plurality of first components formed in or on the substrate. A plurality of metallization layers are provided. A second component applied by transfer printing is provided which is positioned, at least in part, on a level with and laterally adjacent to at least one of the plurality of metallization layers.