Transfer Region Bottom Purge for Precursor-Free Wafer Handling
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Solution Overview
Problem
Semiconductor processing systems face challenges with efficient flow and exhaust of materials, leading to deposition or damage within the system due to dead zones and accumulation of precursors, particularly in transfer regions.
Innovation Solution
The system incorporates a transfer apparatus with a rotatable shaft and end effector having a central hub and arms, along with purge channels and pumping liners, to deliver purge gas efficiently through the transfer region, limiting precursor entry and forming dead zones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If purge gas is delivered through purge channels in the transfer region housing, then precursor accumulation is prevented and system purity is improved, but device complexity increases due to additional purge channels and pumping liners
Solution Approach 1:
The purge gas delivery system is segmented into multiple purge channels (first purge channel, second purge channel, etc.) distributed throughout the transfer region housing, with each channel serving a specific zone. This segmentation allows targeted purging of different regions to prevent precursor accumulation while maintaining manageable system complexity through modular design
Solution Approach 2:
Pumping liners are introduced as intermediary components that facilitate the removal of purge gas and accumulated precursors from the transfer region. These liners act as mediators between the purge channels and the vacuum system, enabling efficient exhaust without requiring direct modification of the entire chamber structure
2Adaptability or versatility
If the transfer apparatus includes a rotatable shaft with end effector having central hub and arms, then substrate transfer capability is improved, but device complexity increases
Solution Approach 1:
The rotatable shaft with end effector is designed as a universal transfer mechanism that can accommodate multiple substrate supports (first substrate support, second substrate support, etc.) and perform various transfer operations between different processing regions. This multi-functional design improves substrate transfer capability while avoiding the need for separate mechanisms for each substrate position
Solution Approach 2:
The transfer apparatus utilizes rotational motion in the horizontal plane combined with vertical translation of substrate supports. By adding the rotational dimension to the vertical translation capability, the system achieves versatile substrate transfer between multiple processing regions without requiring complex multi-axis mechanical structures
3Productivity
If processing regions are fluidly coupled with transfer region, then process efficiency is improved, but harmful deposition occurs in transfer region
Solution Approach 1:
Purge gas is delivered through the purge channels into the transfer region before precursors can accumulate or deposit on surfaces. This preliminary anti-action creates a protective gas barrier that prevents harmful deposition while maintaining the fluid coupling between processing regions, allowing continuous operation without contamination
Solution Approach 2:
The purge gas delivery system operates continuously or in synchronized coordination with substrate transfer and processing operations. This continuous purging action ensures that the transfer region remains free of precursor accumulation throughout the entire processing cycle, maintaining both productivity and preventing deposition without interruption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform gas flow, preventing precursor accumulation and maintaining system integrity by effectively purging the transfer region, thus reducing deposition and damage.
Implementation Method 1
deliver purge gas into a transfer region to prevent formation of dead zones, which may otherwise accumulate processing precursors
Implementation Method 2
Each pumping liner may at least partially define an exhaust flow path from each processing region for a purge gas delivered through the plurality of purge channels
Data Source
AI summary
Exemplary substrate processing systems may include a plurality of processing regions. The systems may include a transfer region housing defining a transfer region fluidly coupled with the plurality of processing regions. The systems may include a plurality of substrate supports, and each substrate support of the plurality of substrate supports may be vertically translatable between the transfer region and an associated processing region of the plurality of processing regions. The systems may include a transfer apparatus including a rotatable shaft extending through the transfer region housing. The transfer apparatus may include an end effector coupled with the rotatable shaft. The end effector may include a central hub defining a central aperture fluidly coupled with a purge source. The end effector may also include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports.