Transfer Substrate Evaporation for OLED Accuracy
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current evaporation methods for manufacturing OLED display devices, such as linear source evaporation scanning, face challenges in achieving high accuracy due to high temperatures deforming masks and substrates, and inefficiencies in material use due to large evaporation distances.
Innovation Solution
An evaporation method involving a transfer substrate that is first coated with evaporation material and then heated to a lower temperature than the evaporation source, allowing the intermediate layer to be transferred to a target substrate, with optimized distances between the evaporation source, transfer substrate, and target substrate to enhance accuracy and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high temperature evaporation source is used, then evaporation efficiency is improved, but substrate deformation occurs due to thermal damage
Solution Approach 1:
The patent introduces a transfer substrate as an intermediary component between the evaporation source and the target substrate. The transfer substrate receives the evaporated material layer at high temperature proximity, then transports it to the target substrate for transfer. This mediator approach allows the evaporation source to operate at high temperature for efficiency while the target substrate is not directly exposed to high heat, preventing thermal deformation.
Solution Approach 2:
The patent segments the evaporation process into two distinct stages: (1) formation of the material layer on the transfer substrate using the high-temperature evaporation source, and (2) transfer of the material layer to the target substrate through heating and peeling. This segmentation separates the high-temperature evaporation function from the substrate deposition function, allowing each to be optimized independently without compromising the other.
2Manufacturing precision
If large evaporation distance is used, then substrate deformation is reduced, but material use efficiency decreases
Solution Approach 1:
The transfer substrate acts as a mediator that enables short-distance evaporation onto itself, then transfers the material to the target substrate. This approach allows the evaporation distance to be minimized (improving material efficiency) while the transfer process manages the thermal exposure issues.
Solution Approach 2:
The patent changes the spatial arrangement by introducing a vertical transfer dimension. The evaporation source deposits material onto the transfer substrate at close distance, then the transfer substrate moves vertically to position the material layer near the target substrate for transfer. This dimensional approach allows short evaporation distances without directly exposing the target substrate to high heat zones.
3Manufacturing precision
If transfer substrate temperature is kept low, then substrate deformation is prevented, but evaporation accuracy is reduced
Solution Approach 1:
The transfer substrate serves as an intermediary that temporarily holds the evaporated material layer. The evaporation accuracy is achieved during the deposition phase when the transfer substrate is positioned near the evaporation source, while the low-temperature operation during transfer prevents substrate deformation. The transfer substrate decouples the requirements for high-precision deposition from low-thermal-stress handling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves evaporation accuracy by reducing substrate deformation and enhances material use efficiency by minimizing evaporation distances, ensuring uniform film formation while maintaining high evaporation efficiency.
Implementation Method 1
evaporating evaporation material and forming evaporation material particles towards one or more transfer substrates by means of an evaporation source
Implementation Method 2
heating the one or more transfer substrates to evaporate the intermediate material layer located on the transfer substrate towards a target substrate
Data Source
AI summary
An evaporation method includes: evaporating evaporation material and forming evaporation material particles towards one or more transfer substrates by means of an evaporation source, so as to form an intermediate material layer on a surface of the transfer substrate; heating the one or more transfer substrates to evaporate the intermediate material layer located on the transfer substrate towards a target substrate, a temperature of the heated transfer substrate being less than a temperature of the evaporation source. There is further disclosed an evaporation device.