Transfer Substrate Recess Geometry for High-Yield Micro-LED Placement
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Solution Overview
Problem
The productivity of micro-LED display apparatus manufacturing decreases as the size of micro-LEDs decreases and the size of displays increases, due to the inefficiencies of the pick and place method used in transferring micro-LEDs.
Innovation Solution
A device transfer substrate with recesses having specific geometric configurations, allowing for high-yield transfer and arrangement of light emitting devices using fluidic or dry self-assembly methods, ensuring each recess accommodates only one device and facilitates electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pick and place method is used for transferring micro-LEDs, then individual device placement is achieved, but productivity decreases as micro-LED size decreases and display size increases
Solution Approach 1:
The recess is divided into multiple regions (first region, second region, overlapping region) that work together to achieve device transfer. The segmentation of the recess structure enables selective device accommodation and transfer while maintaining high productivity
Solution Approach 2:
The overlapping region acts as an intermediary zone between the first and second regions, facilitating the transfer of light emitting devices from the first region to the second region while preventing device loss or misplacement
2Loss of substance
If traditional transfer methods are used, then device transfer is achieved, but the amount of light emitting devices required increases due to redundancy
Solution Approach 1:
Different regions of the recess have different functions: the first region accommodates the device initially, the overlapping region facilitates transfer, and the second region receives the transferred device. This local differentiation of functions reduces redundancy and improves transfer efficiency
Solution Approach 2:
The recess structure is pre-configured with multiple regions and an overlapping area to enable seamless device transfer before the actual transfer process begins, ensuring high reliability and reducing device waste
Data Source
AI summary
A device transfer substrate includes a plurality of recesses, wherein each of the plurality of recesses includes a first region having a shape of a first figure, a second region having a shape of a second figure, and an overlapping region formed as a portion of the first region partially overlaps a portion of the second region, wherein a maximum width of the overlapping region in a direction intersecting with a straight line passing through a center of the first figure and a center of the second figure is less than a diameter or a diagonal length of the first figure and less than a diameter or a diagonal length of the second figure.


