Substrate-Free Transfer Tape Peel Force Control
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Solution Overview
Problem
Existing substrate-free transfer tapes face challenges in maintaining a continuous process due to difficulties in controlling dimensionality and preventing the adhesive layer from lifting during attachment to electronic devices, especially as devices become thinner.
Innovation Solution
A substrate-free transfer tape with a release liner featuring a heavy peel surface and a light peel surface, where the release peel force between the heavy peel surface and the transfer film layer is adjusted between 10 g/in to 70 g/in, allowing for continuous processing without a separate stamping process and minimizing the risk of the transfer film layer being lifted during removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a substrate is not used to reduce adhesive layer thickness, then the thickness of the adhesive layer is reduced, but it becomes difficult to control dimensions through stamping process and control adhesive layer lifting
Solution Approach 1:
The patent introduces a release liner as an intermediary substrate that temporarily supports the transfer film layer during handling and application. This mediator enables precise dimensional control and prevents adhesive layer lifting, while the transfer film can still be applied with minimal thickness to the final adherend.
Solution Approach 2:
The patent segments the adhesive system into distinct functional layers: a release liner providing dimensional stability, a transfer film layer containing the adhesive, and the final adherend. This segmentation allows each layer to perform its specific function optimally - the release liner for dimensional control and the transfer film for thin adhesive application.
2Reliability
If release peel force is too high, then the transfer film layer may be damaged or lifted during removal, but if too low, then the transfer film layer may not transfer properly to the adherend
Solution Approach 1:
The patent optimizes the release peel force parameter to a specific range (10-70 g/in) that balances two requirements: low enough to allow clean transfer film removal without damage, but high enough to maintain proper adhesion during the transfer process. This parameter optimization enables reliable manufacturing.
Solution Approach 2:
The patent creates a dynamic release system where the release liner provides temporary strong adhesion during handling and transfer, then allows controlled release at the optimal peel force during removal. This dynamic behavior adapts to different process stages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a continuous process with minimal thickness attachment to electronic devices, preventing the transfer film layer from lifting during removal, and allowing for efficient application to multiple adherends without damage.
Implementation Method 1
a release liner including a heavy peel surface and a light peel surface; and a transfer film layer provided on the heavy peel surface
Data Source
AI summary
Provided is a substrate-free transfer tape including: a release liner including a heavy peel surface and a light peel surface; and a transfer film layer provided on the heavy peel surface, in which release peel force between the heavy peel surface and the transfer film layer is from 10 g/in to 70 g/in or less at the time of peeling the transfer film layer at a rate of 3 m/min.