Transferable Functional Structures via Release Layer Segmentation
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Solution Overview
Problem
Current methods for printing structures on device substrates are costly and inefficient, particularly in high-throughput processing, and lack effective means for generating transferable semiconductor elements compatible with flexible electronics and nanostructures.
Innovation Solution
A method involving multilayer structures with functional and release layers, where release layers are strategically positioned between functional layers to facilitate sequential or simultaneous release and printing of transferable structures onto device substrates, utilizing techniques such as etching, thermal shocking, or laser ablation for layer separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional printing methods are used for structures on device substrates, then manufacturing cost is high, but throughput is low
Solution Approach 1:
The structure is divided into multiple functional layers (semiconductor layer, electrode layer, insulating layer, etc.) that can be independently released and transferred. Each layer is separated by release layers, allowing selective removal and high-throughput printing of individual functional components onto device substrates, thereby increasing productivity while maintaining cost efficiency.
Solution Approach 2:
The multilayer structure with release layers is prepared in advance on a master substrate. The release layers are strategically positioned between functional layers to facilitate subsequent sequential or simultaneous release. This preliminary preparation enables high-throughput processing by allowing multiple layers to be released and transferred in a single operation or in rapid succession, resolving the contradiction between throughput and manufacturing cost.
2Ease of repair
If release layers are removed to generate transferable structures, then substrate reuse is enabled, but layer separation precision must be high
Solution Approach 1:
Release layers are strategically positioned only at specific locations between functional layers where separation is desired. The release layers have localized properties that enable selective removal without affecting adjacent functional layers. This localized approach allows precise layer separation while enabling substrate reuse, resolving the contradiction between ease of repair and manufacturing precision.
Solution Approach 2:
Release layers act as intermediary elements between functional layers. These intermediary layers are designed to be selectively removable through etching, thermal shocking, or laser ablation, facilitating clean separation of functional layers from the master substrate. The intermediary release layers enable precise control over layer separation while allowing substrate reuse for subsequent manufacturing cycles.
3Device complexity
If multiple functional layers are stacked, then device complexity increases, but control over individual layer release becomes more difficult
Solution Approach 1:
The complex multilayer device structure is segmented into discrete functional layers, each separated by release layers. This segmentation allows independent manipulation and release of each functional layer. Even though the overall device complexity increases with multiple layers, the segmentation enables systematic control over layer release through selective removal of release layers, resolving the contradiction between device complexity and ease of operation.
Solution Approach 2:
The release layers are pre-positioned between functional layers during the stacking process. This preliminary action establishes a controlled release architecture that simplifies subsequent layer separation. By preparing the release structure in advance, the patent enables systematic control over individual layer release even in complex multilayer configurations, resolving the contradiction between device complexity and ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs by enabling the reuse of substrates and allows for the high-throughput production of transferable structures with precise control over layer release, suitable for a wide range of device components including photovoltaics and flexible electronics.
Implementation Method 1
separating one or more of said release layers or a portion thereof from one or more of said functional layers using a technique selected from the group consisting of: etching one or more release layers
Implementation Method 2
thermally shocking one or more release layers
Implementation Method 3
ablating or decomposing one or more release layers by exposure of said release layers to electromagnetic radiation from a laser source
Implementation Method 4
decomposing one or more release layers by contacting said release layers with a chemical agent
Data Source
Figure 1A~1B
Figure 2A
Figure 2B
AI summary
Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.