Transferable Nanostructure Lamellas for Scalable Device Integration
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Solution Overview
Problem
Current methods for handling nanostructured materials are difficult to scale and require invasive processing, limiting their applicability and suitability for commercial use due to substrate dependency and manual circuit design.
Innovation Solution
A method for manufacturing transferable lamellas comprising interconnected nanostructures, where elongated nanostructures are grown or deposited to be conductively interconnected, encapsulated in a material, and then cut to create a lamella that can be transferred to any substrate, enabling systematic device fabrication and scalable production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If nanostructured materials are transferred to substrate using state-of-the-art methods, then device integration is achieved, but scaling and systematic device fabrication become extremely difficult due to manual circuit design requirements
Solution Approach 1:
The patent segments the nanostructured material transfer process into modular components: (1) growth of nanostructures on a first substrate, (2) formation of a transfer layer that couples to the nanostructures, (3) separation of the transfer layer with coupled nanostructures from the first substrate, and (4) transfer to a second substrate. This segmentation enables systematic fabrication and scaling while maintaining device integration capability.
Solution Approach 2:
The patent introduces a transfer layer as an intermediary component between the nanostructured material and the target substrate. This transfer layer serves as a mediator that enables controlled transfer and positioning of nanostructures, facilitating both device integration and scalable manufacturing by decoupling the growth process from the final device assembly.
2Adaptability or versatility
If top-down or bottom-up processing techniques are used to realize networks of nanostructures, then nanostructured networks are formed, but the techniques result in substrate-dependent structures that limit applicability
Solution Approach 1:
The transfer layer acts as an intermediary that decouples the nanostructure formation process from the final substrate, enabling substrate independence. The nanostructures are grown or formed on a temporary substrate, coupled to the transfer layer, and then transferred to the target substrate, allowing the same process to produce structures applicable to multiple different substrates without increasing processing complexity.
Solution Approach 2:
The process is segmented into distinct stages: nanostructure formation on a growth substrate, transfer layer coupling, separation, and final transfer. This segmentation allows the nanostructure network to be created independently of the final substrate, enhancing adaptability while keeping each processing step relatively simple and manageable.
3Reliability
If extensive processing is applied to realize nanostructure networks through top-down or bottom-up techniques, then nanostructured networks are achieved, but the processing becomes invasive and limits applicability
Solution Approach 1:
The transfer layer serves as a protective intermediary during processing, allowing nanostructure networks to be formed and manipulated with reduced invasiveness. By performing operations on the transfer layer rather than directly on the nanostructures, the method reduces processing damage while maintaining network formation reliability.
Solution Approach 2:
The transfer layer is formed and coupled to the nanostructures before final device processing, performing preliminary protective action. This preliminary coupling enables subsequent handling and transfer operations to be performed on the robust transfer layer structure rather than on fragile individual nanostructures, reducing processing invasiveness while ensuring reliable network formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the controllable mass-production and transfer of nanostructures, facilitating the creation of high-efficiency devices like solar cells, sensors, and transistors, independent of substrates, and enables the stacking of lamellas for enhanced device performance and density.
Implementation Method 1
encapsulating at least a portion of said superstructure in an encapsulating material, said portion comprising at least two interconnected nanostructures
Implementation Method 2
cutting the encapsulating material in a direction that intersects at least two interconnected nanostructures, thereby manufacturing a transferable lamella comprising interconnected nanostructures
Data Source
AI summary
The present disclosure relates to a method of manufacturing a transferable lamella comprising interconnected nanostructures, the method comprising the steps of: a) providing a substrate such as a planar substrate; b) forming at least one superstructure on the substrate, said superstructure comprising a plurality of elongated nanostructures (formed e.g. by growth, deposition, and/or etching); wherein the elongated nanostructures are formed such that at least two of said nanostructures are conductively interconnected, and/or wherein at least a first layer is grown or deposited to conductively interconnect or insulate at least a part of the elongated nanostructures; c) encapsulating at least a portion of said superstructure in an encapsulating material, said portion comprising at least two interconnected nanostructures; and d) cutting the encapsulating material in a direction that intersects at least two interconnected nanostructures, thereby manufacturing a transferable lamella comprising interconnected nanostructures. The present disclosure further relates to an electronic device manufactured from one or more of the lamellas provided by the method.