Transferable Semiconductor Components via Sacrificial Layer

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Solution Overview

Problem

Conventional surface-emitting laser diodes with growth substrates are difficult to mount on flexible substrates, requiring significant effort and being time-consuming and cost-intensive, especially when mounting large arrays of components.

Innovation Solution

A method involving a semiconductor structure on an intermediate carrier with a sacrificial layer and anchoring structure, allowing components to be detachable and transferable, enabling easy mounting on flexible substrates without the growth substrate, which reduces thermal resistance and simplifies the mounting process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional surface-emitting laser diodes with growth substrates are used, then the components have structural stability and can be grown epitaxially, but the mounting process becomes time-consuming and cost-intensive when mounting large arrays on flexible substrates

Engineering Contradiction:

Improvemounting processVSAvoidmounting time

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The patent divides the mounting process into two stages: first, components are produced in arrays on a rigid growth substrate (epitaxial growth); second, the entire array is transferred as a unit to the flexible substrate. This segmentation allows efficient mass production while simplifying the final mounting step.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary actions by growing the semiconductor structure epitaxially on the growth substrate before transfer, and by preparing the flexible substrate with appropriate structures in advance. This preliminary preparation enables faster final assembly and reduces mounting time.

Inventive Principle:

Principle #10Preliminary action

2Ease of manufacture

If conventional surface-emitting laser diodes with growth substrates are used, then the components have structural stability, but the mounting process becomes complex and requires significant effort

Engineering Contradiction:

Improvemounting processVSAvoidmounting process complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent segments the manufacturing process into distinct stages: epitaxial growth on rigid substrate, array formation, and bulk transfer to flexible substrate. This segmentation simplifies each individual step while maintaining overall structural stability, reducing the complexity of the complete manufacturing process.

Inventive Principle:

Principle #1Segmentation

3Productivity

If components are produced on a common intermediate carrier, then mass production and transfer are enabled, but the components need to be detachable and transferable which adds process complexity

Engineering Contradiction:

Improvemass production capabilityVSAvoidtransfer process

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent performs preliminary actions by forming the semiconductor structure on the intermediate carrier with built-in release mechanisms before mass transfer. The sacrificial layer is deposited in advance, enabling straightforward detachment of component arrays without complex transfer processes.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces a sacrificial layer as an intermediary between the semiconductor structure and the intermediate carrier. This sacrificial layer facilitates easy detachment and transfer of components to the final flexible substrate, enabling mass production while simplifying the transfer process.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables quick and cost-effective production of transferable and printable components, facilitating their assembly on flexible printed circuit boards with reduced thermal resistance and simplified mounting, allowing for low-cost mass transfer and flexible pitch configurations.

Implementation Method 1

the material of the sacrificial layer is chosen in such a way that it can be dissolved by an etching process without damaging the intermediate carrier and/or the semiconductor structure

Methodology Applied

Scientific EffectEtching process:

Data Source

PatentUS11509113B2Method for producing a plurality of transferable components and composite component of components

Publication Date: 2022.11.22 AMS OSRAM INT GMBH

AI summary

A method for producing a composite component (100) and a composite component (100) comprising a plurality of components (10), a removable sacrificial layer (4), an anchoring structure (3) and a common intermediate carrier (90) are specified. The components each have a semiconductor body (2) comprising an active zone (23), are configured to generate coherent electromagnetic radiation and are arranged on the common intermediate carrier. The sacrificial layer is arranged in a vertical direction between the intermediate carrier and the components. The anchoring structure comprises a plurality of anchoring elements (3A, 3B), wherein the anchoring structure and the sacrificial layer provide a mechanical connection between the intermediate carrier and the components. Without the sacrificial layer, the components are mechanically connected to the intermediate carrier solely via the anchoring elements, wherein the anchoring elements are formed in such a way that under mechanical load they release the components so that the components are detachable from the intermediate carrier and are thus formed to be transferable.