Transferable Thin-Film Optical Devices for AR/VR Headsets

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Solution Overview

Problem

Current thin-film optical devices face challenges in being transferred and handled without degrading their optical properties, as removal from substrates can cause tearing or stress, disrupting the molecular pattern and degrading their functionality.

Innovation Solution

A transferrable thin-film optical device is developed, featuring a thin-film layer with a molecular pattern that can be preserved during separation and reattachment, allowing for flexible and removable attachment to various substrates using methods like thermal release or soluble barriers, enabling transfer without affecting optical functions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If thin-film optical devices are printed directly on a substrate, then the optical elements can be manufactured and handled, but removal from the substrate would cause tearing or stress to the thin films, degrading the optical properties

Engineering Contradiction:
Improvemanufacturing of thin-film optical devicesVSAvoidoptical properties after removal
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The thin-film optical device is segmented into a functional thin-film layer and a separate carrier substrate. The thin-film layer is formed on the carrier substrate using standard fabrication processes, then the entire assembly is transferred to the final destination substrate. This segmentation allows the thin film to be handled during manufacturing without being permanently bonded to the final substrate, preventing tearing and stress damage while maintaining optical properties.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A carrier substrate serves as an intermediary during the manufacturing and transfer process. The thin-film optical layer is first formed on this temporary carrier substrate, which provides mechanical support and enables standard fabrication techniques. After the thin-film layer is fully formed and optimized, the carrier substrate is removed or transferred along with the thin-film layer to the final destination, allowing the thin film to be manufactured without direct bonding to the final substrate that would cause damage upon removal.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If thin-film optical devices are printed directly on a substrate, then the optical elements can be manufactured, but they are substantially difficult to be transferred and/or handled without degrading the optical properties

Engineering Contradiction:
Improvemanufacturing of thin-film optical devicesVSAvoidtransferability to different substrates
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

By separating the thin-film optical layer from the final substrate through the use of a carrier substrate, the system enables independent optimization of each component. The thin-film layer can be manufactured, tested, and optimized on the carrier substrate, then transferred to various different destination substrates as needed. This segmentation provides adaptability and versatility in applying the same thin-film optical design to different substrate types and applications.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The carrier substrate approach creates a universal manufacturing platform where the same thin-film optical layer can be transferred to multiple different destination substrates. The carrier substrate acts as a universal intermediary that accommodates various fabrication processes and enables the thin-film layer to be adapted to different application requirements and substrate types without remanufacturing.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If a separating film is placed between the functional film and the base plate, then the functional film can be transferred, but the device complexity increases

Engineering Contradiction:
Improvetransferability of functional filmVSAvoidstructure of thin-film optical device
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The carrier substrate serves as a robust intermediary that enables transfer of the thin-film optical layer without requiring complex separating films. The carrier substrate provides strong mechanical support and a reliable interface for forming the thin-film layer, then allows for clean separation or transfer to the destination substrate. This approach simplifies the overall device structure compared to using specialized separating films, while still achieving effective transfer capability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP3834033B1Transferable thin-film optical devices
Publication Date: 2023.08.30 META PLATFORMS TECHNOLOGIES LLC
  • EP3834033B1 patent drawingFigure 1~2A
  • EP3834033B1 patent drawingFigure 2B~3B
  • EP3834033B1 patent drawingFigure 4A~4B

AI summary

A transferrable thin-film optical device and a head-mounted display are provided. A transferrable thin-film optical device comprises a thin-film layer providing at least one predetermined optical function. The thin-film layer is configured to be removably attached to a substrate, such that a molecular pattern for the at least one predetermined optical function of the thin-film layer is preserved post removal.