Transferable Trace Lead Frame for Miniaturized IC Packaging
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Solution Overview
Problem
There is a need for an integrated circuit packaging system that can be manufactured with a low cost, improved yields, and reduced dimensions, while also allowing for flexible stacking and integration configurations, particularly in portable devices where miniaturization is critical.
Innovation Solution
The method involves using a transferable trace lead frame, where a lead frame is shaped to form a conductive land with a metal connector on its upper surface and a bottom cover, encapsulated with a bottom encapsulation, and an integrated circuit die is connected directly to the metal connectors, with optional external and internal interconnects and encapsulations for enhanced functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional IC packaging methods are used, then manufacturing cost and device size are reduced, but packaging density and performance are limited
Solution Approach 1:
The patent transitions from planar lead frame layouts to three-dimensional vertical stacking configurations. Multiple IC dies are stacked vertically with interconnect structures extending in the vertical dimension, enabling higher packaging density without increasing the horizontal footprint of the package.
Solution Approach 2:
The patent implements nested configurations where multiple IC dies and interconnect structures are arranged in concentric or layered patterns. Inner lead frames are positioned within outer lead frames, and multiple dies are stacked with each die containing or surrounded by interconnect structures, creating a nested arrangement that maximizes space utilization.
2Ease of manufacture
If lead frame structure is simplified for cost reduction, then manufacturing cost decreases, but routing flexibility and connection reliability are compromised
Solution Approach 1:
The lead frame structure is segmented into multiple functional layers including inner lead frames, outer lead frames, and intermediate interconnect structures. Each segment performs specific routing functions, allowing complex electrical connections to be achieved through simple, standardized segments that are easy to manufacture.
Solution Approach 2:
The lead frame structures are designed with multi-functionality, serving as both structural support elements and electrical interconnect pathways. The same lead frame components provide mechanical strength while simultaneously routing electrical signals, reducing the need for separate specialized components and simplifying manufacturing.
Data Source
AI summary
System and method of manufacturing an integrated circuit packaging system using transferable trace lead frame. A lead frame is provided having lower metal contacts. A masking layer can be formed on an upper surface of the lead frame for protection and shielding purposes. Routing layer and conductive lands may subsequently be formed by shaping the lead frame, along with bottom encapsulation. The masking layer may subsequently be removed for additional processing steps including connecting an integrated circuit die to the upper surface of the lead frame.