Transformer Chip Signal Isolation Without High-Voltage Processing
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Solution Overview
Problem
Existing signal transmission devices require high-withstand-voltage processes, which are costly and inefficient for isolating and transmitting signals between primary and secondary circuit systems in applications like power supply and motor driving devices.
Innovation Solution
A signal transmission device using a transformer chip with spiral coils and a semiconductor device incorporating wide band gap semiconductors, allowing for AC connection and DC isolation between primary and secondary circuits, reducing the need for high-withstand-voltage processes and lowering manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-withstand-voltage processes are used to isolate primary and secondary circuit systems, then signal transmission reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent introduces a transformer chip as an intermediary device between the primary and secondary circuit systems. This transformer chip provides galvanic isolation through magnetic coupling, enabling reliable signal transmission without requiring expensive high-withstand-voltage processes in the main circuit boards. The intermediary transformer handles the voltage isolation function, allowing the rest of the system to use standard, lower-cost manufacturing processes.
2Reliability
If high-withstand-voltage processes are used for circuit isolation, then electrical safety is improved, but manufacturing efficiency decreases
Solution Approach 1:
The patent segments the isolation function into a separate, modular transformer chip component. This segmentation allows the main circuit boards to be manufactured using efficient, standard processes while the transformer chip is manufactured separately with specialized processes. The modular approach enables parallel manufacturing and assembly, significantly improving overall manufacturing efficiency compared to applying high-withstand-voltage processes to entire circuit boards.
3Reliability
If complex isolation structures are used between primary and secondary circuits, then signal transmission stability is improved, but device complexity increases
Solution Approach 1:
The transformer chip serves as a compact intermediary that provides stable signal transmission through magnetic coupling. This single integrated component replaces what would otherwise require complex multi-layer isolation structures, shielded cables, and multiple isolation stages. The transformer's magnetic core and wound coils provide inherent stability against electrical noise and ground potential differences without adding significant structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient signal transmission with reduced manufacturing costs by utilizing common low-to-middle-withstand-voltage processes, suitable for applications in vehicles such as engine, electric, and hybrid electric vehicles.
Implementation Method 1
a transformer chip with spiral coils and a semiconductor device incorporating wide band gap semiconductors, allowing for AC connection and DC isolation between primary and secondary circuits
Implementation Method 2
A signal transmission device using a transformer chip with spiral coils and a semiconductor device incorporating wide band gap semiconductors, allowing for AC connection and DC isolation between primary and secondary circuits, reducing the need for high-withstand-voltage processes and lowering manufacturing costs
Data Source
AI summary
A signal transmission device includes a first logic, a second logic, a plurality of isolation devices configured to isolate and transmit a plurality of sets of first signals and second signals between the first logic and the second logic, and a plurality of output circuits configured to generate a plurality of output signals according to instructions from the second logic. The first logic is capable of simultaneously transmitting a plurality of combinations of signals from different sets among the plurality of sets of the first signals and the second signals. The second logic performs operations according to the combination of signals received via the plurality of isolation devices from among the plurality of sets of the first signals and the second signals.