Transformer Circuit Board Stamping Method for Leakage Inductance
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Solution Overview
Problem
Conventional transformer circuit board manufacturing methods face issues with lateral etching during the etching process, leading to uneven copper foil diameters, incomplete adherence between layers, and reduced manufacturing efficiency and yield, along with safety concerns from chemical agents.
Innovation Solution
A manufacturing method that replaces conventional exposing, developing, and etching with stamping molding, involving plate stamping, primary and secondary layering, and hot pressing to align and secure metal plates between insulation layers, eliminating lateral etching and enhancing consistency and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chemical agents are applied for etching the copper foil surface, then the layout can be manufactured, but lateral etching occurs causing uneven copper foil diameter and affecting transformer properties
Solution Approach 1:
The patent replaces the chemical etching system with a mechanical stamping system. A stamping mold with precise cavity dimensions directly forms the copper foil layout through mechanical pressure, eliminating the chemical etching process that caused lateral etching and diameter variations. This mechanical approach ensures uniform copper foil diameter and precise layout dimensions.
Solution Approach 2:
The stamping mold cavity serves as a precise negative copy of the desired layout shape. By pressing the copper foil against the stamping mold cavity, the exact layout pattern is transferred mechanically, ensuring consistent dimensions and eliminating the dimensional variations caused by chemical etching processes.
2Ease of manufacture
If chemical agents are used for etching, then layout manufacturing is achieved, but incomplete adherence and bubbles occur between layer structures
Solution Approach 1:
The patent replaces chemical etching with mechanical stamping to form layouts. This eliminates chemical residues and surface irregularities that caused incomplete adherence and bubbles between layers. The mechanical stamping process creates clean, precise layout structures that ensure reliable bonding between layer structures.
3Ease of manufacture
If chemical agents are applied for etching, then layout can be manufactured, but manufacturing efficiency and yield rate are reduced
Solution Approach 1:
The patent replaces the multi-step chemical etching process (exposing, developing, etching, cleaning) with a single-step mechanical stamping process. This dramatically reduces manufacturing steps, time, and complexity, thereby improving production efficiency and yield rate while maintaining layout manufacturing capability.
Solution Approach 2:
The stamping mold is pre-formed with the exact layout pattern and dimensions required. This preliminary preparation allows direct stamping of the copper foil without requiring subsequent chemical processing steps, streamlining the manufacturing process and improving efficiency.
4Ease of manufacture
If chemical agents are used for etching, then layout manufacturing is possible, but manufacturing environment safety is compromised
Solution Approach 1:
The patent replaces the chemical etching system that uses hazardous chemicals with a mechanical stamping system. This eliminates the need for chemical agents, improving manufacturing environment safety while maintaining the ability to manufacture layouts precisely.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the yield rate and production quality of transformer circuit boards by preventing lateral etching, ensuring precise alignment, and reducing environmental hazards, resulting in a transformer with low leakage inductance and high electromagnetic interference shielding.
Implementation Method 1
plate stamping, forming a plurality of metal plates with a stamping mold
Implementation Method 2
primary pressing, hot pressing to combine the outer insulation layers and the inner insulation layer in a thermal melting manner
Data Source
AI summary
A manufacturing method of transformer circuit board includes following steps: plate stamping, forming a plurality of metal plates with a stamping mold; primary layering, layering the metal plates that are in alignment with each other between two outer insulation layers, with an inner insulation layer disposed between the two metal plates; primary pressing, hot pressing the metal plates to fix the metal plates between the two outer insulation layers; secondary layering, layering another metal plate on the outer side of the two outer insulation layers, respectively, corresponding to the positions of the previously layered metal plates; secondary pressing, hot pressing the metal plates on the outer side of the outer insulation layers, and printing to form a solder mask layer on the outer insulation layers. Finally, cutting to form a transformer circuit board with low leakage inductance and high EMI shield.