Thermal Conductive Plates in Transformer Core Assembly

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Solution Overview

Problem

High power level transformers experience high loss densities and heat buildup, leading to degradation of magnetic and insulation properties, and potential catastrophic failure due to increased temperature, which limits miniaturization and operational lifespan.

Innovation Solution

The implementation of a core assembly with thermally conductive plates and a thermally conductive housing that bisect core layers and are in thermal contact with windings, facilitating efficient heat removal and reducing hot spot temperatures, thereby preventing electrical shorts and extending device lifespan.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the core and transformer dimensions are increased to maintain reasonable temperature rises, then thermal management is improved, but device size increases and miniaturization is limited

Engineering Contradiction:
Improvetemperature riseVSAvoidtransformer size
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The core assembly is divided into multiple core layers with thermally conductive plates inserted between them, creating segmented thermal pathways that allow efficient heat removal without increasing overall transformer dimensions

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Thermally conductive plates are introduced as intermediary components between core layers to facilitate heat transfer from the core to the housing, enabling effective thermal management within compact dimensions

Inventive Principle:
Principle #24Intermediary (Mediator)

2Power

If high power levels are achieved in compact structure, then power density is improved, but heat buildup increases causing degradation and potential failure

Engineering Contradiction:
Improvepower levelVSAvoiddevice reliability
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

Heat removal is achieved by introducing thermal pathways in the axial direction through thermally conductive plates and housing, adding a dimensional aspect to heat dissipation that doesn't require increasing radial or lateral dimensions

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Heat is extracted from the core assembly through thermally conductive plates that conduct heat to the housing, which then dissipates heat to the environment, effectively removing harmful thermal energy from the compact structure

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces heat transfer to windings, lowers temperature rises, and allows for further miniaturization of transformers by enhancing thermal management, preventing magnetic property degradation and extending the operational lifespan of the device.

Implementation Method 1

the thermally conductive plate is in thermal contact with the closed cores to transfer heat away from the interior of the core assembly

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The core assembly may be surrounded by a thermally conductive housing that is in thermal contact with the thermally conductive plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230215613A1Thermal management of electromagnetic device
Publication Date: 2023.07.06 MURATA MFG CO LTD
  • US20230215613A1 patent drawing
  • US20230215613A1 patent drawing
  • US20230215613A1 patent drawing

AI summary

An electromagnetic device is provided with improved thermal management. The electromagnetic device includes a core assembly and one or more sets of windings wrapped around the core assembly. The core assembly is constructed from a plurality of U-shaped cores, or from a plurality of U-shaped cores and I-shaped cores in combination. Various arrangements of thermally conductive plates disposed within the core assembly are provided. The thermally conductive plates transfer heat away from the core assembly to improve the thermal characteristics of the electromagnetic device.