Transformer Thermal Radiator for Power FET Cooling
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Solution Overview
Problem
Power field effect transistors (FETs) in information handling systems generate significant heat, which is difficult to dissipate efficiently due to their small size, leading to potential operational temperature exceedance and device failure.
Innovation Solution
A transformer thermal radiator is thermally coupled with the power FET, utilizing a radiant heat exchanger and electrical conductors to transfer heat from the FET to the transformer, where it is dissipated by a radiant heat exchanger, maintaining the FET's temperature within operational limits while minimizing the size of the power adapter device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power FETs are made small to reduce device size, then the power adapter device size is reduced, but heat dissipation becomes difficult and operational temperature may be exceeded
Solution Approach 1:
The patent combines the transformer and heat exchanger into a single integrated component. The transformer serves dual functions: electrical transformation and heat dissipation. The heat exchanger is thermally coupled to the power FET through the transformer structure, allowing heat to be transferred from the FET to the transformer windings and then dissipated to the ambient environment. This merging eliminates the need for separate cooling components, reducing overall device size while maintaining effective heat dissipation.
Solution Approach 2:
The transformer is designed to perform multiple functions simultaneously: electrical voltage transformation and thermal management. The transformer windings act as both electrical conductors and heat transfer medium. The same transformer structure that performs electrical isolation and voltage conversion also serves as the primary heat dissipation pathway for the power FET, maximizing component utility and minimizing device footprint.
2Temperature
If traditional heat dissipation methods are used for power FETs, then heat can be dissipated, but the device complexity and size increase
Solution Approach 1:
The patent merges the heat exchanger with the transformer structure, eliminating the need for separate cooling components. The transformer windings themselves serve as the heat transfer medium, and the transformer housing acts as the heat dissipation structure. This integration simplifies the overall cooling system design and reduces device complexity compared to traditional solutions that require independent heat sinks, thermal paste, and mounting hardware.
Solution Approach 2:
The transformer serves its own cooling function while simultaneously cooling the power FET. The transformer's inherent structure with its windings and core provides natural heat dissipation pathways. The system uses the transformer's own thermal mass and surface area for heat dissipation without requiring external active cooling mechanisms, reducing system complexity and improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively cools the power FET, maintaining it below maximum operational temperatures and allowing for a compact design by increasing the heat dissipation rate, thus preventing overheating and potential device failure.
Implementation Method 1
a radiant heat exchanger thermally coupled to the transformer PCB... heat may flow via the heat transfer path to the transformer
Implementation Method 2
transformer thermal radiator for power field effect transistors... radiant heat exchanger... increasing the heat dissipation rate
Data Source
AI summary
A power adapter device may include a power field effect transistor (FET), a transformer including a radiant heat exchanger, and electrical conductors coupled between the power FET and the transformer. The electrical conductors may transfer heat generated by the power FET from the power FET to the transformer. The radiant heat exchanger may dissipate a portion of the heat to cool the power FET. As such, the radiant heat exchanger may function as a heat sink for the power FET, enabling efficient heat dissipation using a compact design.