Transformer Interface Layer for Flat Circuit Board Attachment
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Solution Overview
Problem
Conventional transformers face issues with uneven pin fixation, poor solderability, and inadequate heat dissipation due to the small surface area of the adhesive on the magnetic core, leading to insecure circuit board attachment and inefficient heat transfer.
Innovation Solution
The introduction of an interface layer with flat surfaces, which can be a thermal pad with high thermal conductivity, is placed between the magnetic core and the circuit board to ensure even attachment, improve solderability, and enhance heat dissipation by filling gaps and providing a consistent bonding surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is dispensed on a small surface of the magnetic core, then the magnetic core structure is maintained, but the circuit board cannot be firmly secured and pins become uneven
Solution Approach 1:
An interface layer is introduced between the magnetic core and the circuit board to serve as an intermediary component. This interface layer has a larger surface area than the magnetic core surface, providing sufficient area for uniform adhesive distribution. The interface layer acts as a mediator that ensures the circuit board is firmly secured while maintaining pin evenness, resolving the contradiction between attachment strength and manufacturing precision.
2Stability of the object's composition
If adhesive is dispensed manually on a small indentation surface, then the magnetic core structure is preserved, but the adhesive cannot be uniformly spread
Solution Approach 1:
The interface layer serves as a mediator between the magnetic core and the adhesive. It provides a larger, flatter surface that facilitates uniform adhesive spreading while the adhesive is still applied to the magnetic core indentation. The interface layer's larger surface area allows for better adhesive distribution control, resolving the contradiction between maintaining magnetic core structure and achieving adhesive uniformity.
3Device complexity
If the circuit board is attached directly to the magnetic core with small surface area, then the magnetic core assembly is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The interface layer acts as a thermal intermediary between the magnetic core and the circuit board. It provides a larger thermal contact area that improves heat transfer efficiency from the magnetic core to the circuit board, which then dissipates heat to the external environment. Although this adds a component, the interface layer is typically a simple flat structure that minimizes complexity increase while significantly improving heat dissipation.
4Shape
If adhesive is applied to a small indentation surface, then the magnetic core geometry is maintained, but the circuit board becomes tilted
Solution Approach 1:
The interface layer serves as a geometric mediator that compensates for the small indentation surface area of the magnetic core. It provides a larger, flatter surface that supports the circuit board in a horizontal position, preventing tilting. The interface layer maintains the magnetic core's original geometry while ensuring circuit board flatness, resolving the contradiction between shape preservation and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interface layer ensures the circuit board lies flat, secures pins evenly, prevents brittleness, and significantly improves heat dissipation efficiency, increasing the reliability and yield of the transformer.
Implementation Method 1
The introduction of an interface layer with flat surfaces, which can be a thermal pad with high thermal conductivity, is placed between the magnetic core and the circuit board to ensure even attachment, improve solderability, and enhance heat dissipation
Implementation Method 2
dispensing adhesive 15 is coated on a small portion of the surface of the second indentation 1323 of the second magnetic part 132, so that the circuit board 11 is attached onto the second magnetic part 132
Data Source
AI summary
A transformer includes a magnetic core assembly, a circuit board, a plurality of pins and at least an interface layer. The magnetic core assembly includes a first magnetic part and a second magnetic part. The circuit board is arranged between the first magnetic part and the second magnetic part, and has a winding coil patterns including a primary winding coil and at least a secondary winding coil. The pins have first ends mounted onto the circuit board. The interface layer is arranged between the first magnetic part and the circuit board and/or between the second magnetic part and the circuit board such that the circuit board lies flat on the interface layer and is secured to the first magnetic part or the second magnetic part via the interface layer.