Transformer-Isolated Gate Signal Transmission With Adaptive Feedback Pulses
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Solution Overview
Problem
Existing signal transmission devices require dedicated high-withstand-voltage processes, increasing manufacturing costs and complexity, especially in applications like vehicle-mounted power supply and motor driving devices, where efficient pulse signal transmission with isolation between input and output is necessary.
Innovation Solution
A semiconductor integrated circuit device with a transformer chip that isolates between primary and secondary circuit systems using transformers, eliminating the need for high-withstand-voltage processes by integrating a controller chip, driver chip, and transformer chip in a single package, employing spiral coils for efficient pulse signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dedicated high-withstand-voltage processes are used to ensure isolation between primary and secondary circuit systems, then reliability is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent combines the primary circuit system and secondary circuit system into a single integrated circuit device, with both circuits formed on the same semiconductor substrate. This integration eliminates the need for separate high-withstand-voltage packaging processes while maintaining electrical isolation through careful layout design and insulation structures formed during standard semiconductor manufacturing.
Solution Approach 2:
The patent changes the approach from using high-withstand-voltage materials and processes to using standard semiconductor manufacturing parameters. By controlling the electrical isolation through layout geometry, insulation layer thickness, and transistor design parameters rather than specialized high-voltage processes, the device achieves reliable isolation with standard manufacturing.
2Reliability
If dedicated high-withstand-voltage processes are used to ensure isolation between primary and secondary circuit systems, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the primary circuit system and secondary circuit system into a single integrated circuit device, with both circuits formed on the same semiconductor substrate. This integration eliminates the need for separate high-withstand-voltage packaging processes while maintaining electrical isolation through careful layout design and insulation structures formed during standard semiconductor manufacturing.
Solution Approach 2:
The patent uses standard, inexpensive semiconductor manufacturing processes instead of costly specialized high-withstand-voltage processes. By relying on routine fabrication techniques and standard materials, the device achieves reliable isolation at lower manufacturing cost.
3Reliability
If isolation between primary and secondary circuit systems is implemented using traditional methods, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines the primary circuit system and secondary circuit system into a single integrated circuit device, with both circuits formed on the same semiconductor substrate. This integration eliminates the need for separate high-withstand-voltage packaging processes while maintaining electrical isolation through careful layout design and insulation structures formed during standard semiconductor manufacturing.
Solution Approach 2:
The patent introduces insulation structures and layout design as intermediaries to achieve electrical isolation between the primary and secondary circuit systems. Rather than using complex physical separation or specialized high-voltage packaging, the isolation is achieved through standard semiconductor insulation layers and careful circuit placement on the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing costs and simplifies production while maintaining effective pulse signal transmission and isolation, suitable for various vehicle-mounted electronic devices.
Implementation Method 1
A semiconductor integrated circuit device with a transformer chip that isolates between primary and secondary circuit systems using transformers
Data Source
AI summary
A signal transmission device includes a logic in a primary circuit system, a logic and a driver in a secondary circuit system, and a first and a second transformer circuit that transmit driving pulse signals and feedback pulse signals between the logics while isolating between the primary and secondary circuit systems. The second logic has a function of determining the logic level of a gate signal by driving the driver according to the driving pulse signals, a function of pulse-driving the feedback pulse signals at a predetermined period, with a first number of pulses at a time, if the secondary circuit system is in normal condition, and a function of switching the first number of pulses according to the driving capacity of the driver.