Transformer Power Delivery for Semiconductor Packages With High Current
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Solution Overview
Problem
Large semiconductor devices require high current at low voltages, posing challenges for packaging technologies in terms of power, thermal, and signal demands, and existing power converters are inefficient in converting power and occupy precious silicon real estate.
Innovation Solution
A method and apparatus that utilize a driver circuit outside the semiconductor package to supply power to semiconductor chips through a transformer-based power conversion system, with a power bus carrying AC power and rectification circuits to provide DC power, allowing for efficient power transfer and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If on-silicon switching regulators are used in semiconductor devices, then power conversion is integrated within the chip, but silicon real estate is occupied and power conversion efficiency is reduced
Solution Approach 1:
The patent extracts the power conversion function from the semiconductor chip by implementing a separate driver circuit that operates outside the package. This allows the chip to focus on its primary function while power conversion is handled by an external resonant power converter, thereby improving power conversion efficiency without occupying silicon real estate.
Solution Approach 2:
The patent introduces an intermediary resonant power converter as a mediator between the power source and the semiconductor chip. This intermediary handles the power conversion externally, providing high current at low voltage without requiring on-chip switching regulators, thus resolving the contradiction between integration and efficiency.
2Power
If high current at low voltage is supplied to large semiconductor devices, then power demands are met, but thermal management and packaging challenges increase
Solution Approach 1:
The patent segments the power delivery system into external power conversion (driver circuit) and internal power distribution (on-chip). By placing the high-current generation externally, thermal management is separated from the semiconductor chip, allowing independent optimization of both power conversion and thermal dissipation.
Solution Approach 2:
The patent replaces traditional on-chip mechanical/electrical switching regulators with an external resonant power conversion system. This substitution allows high current delivery with reduced thermal dissipation on the chip itself, as the external converter can be optimally positioned for thermal management.
3Power
If traditional power converters are used, then power conversion is achieved, but space requirements and manufacturing complexity increase
Solution Approach 1:
The patent moves the power conversion function from the two-dimensional chip plane to the three-dimensional space outside the package. This dimensional transition allows power conversion components to be positioned in space rather than confined to the chip surface, reducing space requirements on the semiconductor device itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient power supply to semiconductor chips with reduced thermal dissipation and space requirements, improving the efficiency and reliability of power conversion while accommodating high current demands.
Implementation Method 1
a power transformer including a first winding and a second winding, an input connected to the first winding for receiving AC power from the driver output
Implementation Method 2
a rectification circuit connected to the second winding for rectifying power received from the transformer
Data Source
AI summary
A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die. Multi-output POL circuits may be used in conjunction with on-chip rail-selection and regulation circuitry to further improve efficiency. A three-stage power conversion system includes off-package, on-package and on-chip conversion stages.