Transformer Sealing Compound for Heat Dissipation and 10 KV Isolation
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Solution Overview
Problem
Existing thermal conductive compounds for power transformers do not adequately address the need for increased heat dissipation while maintaining electrical isolation and mechanical integrity, especially under high electrical voltages.
Innovation Solution
A thermal conductive compound comprising a silicone resin with a combination of natural mineral fillers, aluminium hydroxide, and a limited amount of thermoconductive and electroconductive particles, which provides enhanced thermal conductivity and electrical isolation up to 10 KV, and is used to seal and encapsulate power transformer assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal conductive compound is used to increase heat dissipation, then thermal conductivity is improved, but electrical isolation is compromised
Solution Approach 1:
The patent changes the electrical parameter of the thermal conductive compound by limiting electroconductive particles to less than 5% by weight, transforming it from a potentially conductive state to an electrically isolated state while maintaining thermal performance above 1.5 W/mK
Solution Approach 2:
The patent creates a composite thermal conductive compound combining thermally conductive particles (metallic particles, metal oxides, or graphite) with a silicone resin matrix, where the composite structure provides both thermal conductivity and electrical isolation properties
2Temperature
If inorganic fillers are added to increase thermal conductivity, then thermal conductivity is improved, but linear expansion coefficient increases
Solution Approach 1:
The patent changes the thermal and dimensional parameters by selecting specific inorganic fillers (metallic particles, metal oxides, graphite) with controlled sizes (0.1-2.0 mm) and proportions, achieving thermal conductivity above 1.5 W/mK while maintaining linear expansion coefficient below 300 x 10^-6/K
Solution Approach 2:
The patent applies local quality by using a heterogeneous distribution of different particle types and sizes within the silicone resin matrix, where thermally conductive particles are dispersed to provide heat dissipation pathways without creating uniform thermal expansion
3Temperature
If electroconductive particles are added to improve thermal conductivity, then thermal dissipation is improved, but electrical resistance decreases
Solution Approach 1:
The patent precisely controls the concentration of electroconductive particles, limiting them to less than 5% by weight of the total compound, which maintains electrical resistance above 10 MΩ at 10 KV while achieving thermal conductivity above 1.5 W/mK
Solution Approach 2:
The silicone resin matrix acts as an intermediary that surrounds and isolates the electroconductive particles, allowing thermal energy to be conducted through the particles while the resin matrix maintains electrical isolation between them
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compound significantly increases thermal dissipation capabilities and ensures electrical isolation, reducing linear expansion coefficients and improving heat evacuation, while maintaining mechanical protection and reducing manufacturing costs.
Implementation Method 1
a given amount of aluminium hydroxide lowering the linear expansion coefficient and increasing the thermal conductivity of said silicone resin
Implementation Method 2
a third filler comprising a given limited amount of thermoconductive and electroconductive particles providing an electrical resistance to the thermal conductive compound which ensures an electrical isolation of the thermal conductive compound under an electrical voltage above 10 KV
Implementation Method 3
The compound significantly increases thermal dissipation capabilities and ensures electrical isolation, reducing linear expansion coefficients and improving heat evacuation
Data Source
Figure 1~2
Figure 3
AI summary
A power transformer assembly and a thermal conductive compound for sealing a power transformer assembly are disclosed. The power transformed assembly has a magnetic core with at least first and second wound coils that are sealed by a thermal conductive compound comprised of a silicone resin and fillers. The fillers at least include a first filler, or main filler, and a second filler. The second filler includes a given amount of aluminium hydroxide lowering linear expansion coefficient and increasing the thermal conductivity of said silicone resin. The first filler is a natural mineral filler.