Transient Liquid Cooling for Dynamic Die Temperature Reset Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional liquid cooling systems face challenges such as high maintenance costs, lack of scalability, and serviceability issues due to immersion fluid loss, as well as the inability to dynamically adjust cooling based on thermal limits, leading to processor resets and reboots in fluctuating environments.
Innovation Solution
A transient liquid cooling system with a temperature sensor and miniature reservoir that adjusts cooling on demand using a machine learning algorithm to predict thermal limits, momentarily boosting or reducing cooling to extend the operating temperature range of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid cooling systems are used, then cooling capacity is provided, but maintenance costs increase and serviceability deteriorates due to immersion fluid loss
Solution Approach 1:
The cooling system is segmented into modular components: a cooling assembly with cold plate that can be detached from the processor package, and a separate immersion cooling reservoir. This segmentation allows the cooling assembly to be serviced independently without draining the entire immersion fluid reservoir, improving serviceability while maintaining cooling capacity.
Solution Approach 2:
A thermal interface material or thermal vias act as intermediaries between the processor die and the cold plate, enabling efficient heat transfer without requiring complete immersion of the processor in cooling fluid. This intermediary approach maintains effective cooling while reducing immersion fluid loss and improving maintainability.
2Temperature
If conventional liquid cooling systems are used, then cooling is provided, but scalability is limited due to high maintenance costs
Solution Approach 1:
The system incorporates dynamic temperature range reset prevention that allows the processor to operate beyond traditional dynamic temperature ranges (DTR) by actively managing thermal conditions. This dynamic approach enables scalability across different processor packages and cooling configurations without being constrained by fixed temperature limits.
Solution Approach 2:
The cooling assembly with cold plate design provides multi-functionality: it can be used with different processor packages, supports various immersion fluid types, and can operate in both immersed and non-immersed configurations. This universality enhances scalability across different application scenarios while maintaining effective cooling.
3Device complexity
If cooling is not dynamically adjusted, then system simplicity is maintained, but processor resets occur due to thermal limits in fluctuating environments
Solution Approach 1:
Temperature sensors provide feedback to the processor about thermal conditions, enabling the system to detect when temperature thresholds are approaching and trigger appropriate responses such as throttling or activating the cooling assembly. This feedback mechanism prevents processor resets due to thermal limits while maintaining relatively simple system architecture.
Solution Approach 2:
The system performs preliminary thermal management by proactively cooling the processor before temperature thresholds are exceeded. The cooling assembly can be activated in advance based on predicted thermal conditions or gradual temperature increases, preventing processor resets before they occur rather than reacting after thermal limits are breached.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents processor resets and reboots by maintaining optimal operating temperatures within defined specifications, reducing maintenance costs, and enhancing scalability and flexibility in thermal management.
Implementation Method 1
a liquid cooling component thermally coupled to the semiconductor die
Implementation Method 2
a phase change material disposed within the heat storage component
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Dynamic temperature range management techniques are described. A method comprises detecting a temperature of a semiconductor die meets a first threshold value of a dynamic temperature range for the semiconductor die, generating a first control directive for a liquid cooling system to start delivery of a cooling fluid to a liquid cooling component of the semiconductor die to reduce the temperature of the semiconductor die, detecting the temperature of the semiconductor die meets a second threshold value of the dynamic temperature range for the semiconductor die, the second threshold value lower than the first threshold value of the dynamic temperature range, and generating a second control directive to stop delivery of the cooling fluid to the liquid cooling component of the semiconductor die. Other embodiments are described and claimed.