Transient Silicon Devices via Transfer Printing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for implementing transient devices face challenges in designing strategies that support fabrication using degradable materials, controlling the device's useful lifetime, and ensuring compatibility with target environments, particularly for applications requiring eco-degradability and bioresorbability.
Innovation Solution
The development of transient electronic devices that incorporate degradable components and substrates with programmable degradation rates, allowing for the integration of high-performance inorganic semiconductor materials with selectively removable substrates and encapsulants, utilizing transfer printing and conventional wafer processing to achieve desired transient profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If degradable materials and substrates are used to create transient devices, then environmental compatibility and biocompatibility are improved, but device performance and manufacturing reliability deteriorate
Solution Approach 1:
The device is divided into two distinct segments: a transient segment made of degradable materials (substrate, encapsulant, interconnects) and a permanent segment containing high-performance inorganic semiconductor components. This segmentation allows each part to be optimized independently - the transient part for environmental compatibility and the permanent part for reliable performance.
Solution Approach 2:
A release layer is introduced as an intermediary between the permanent semiconductor components and the transient substrate. This intermediary enables the components to be fabricated using conventional high-reliability processes, then transferred to the degradable substrate, bridging the gap between reliable manufacturing and environmental compatibility.
2Manufacturing precision
If conventional semiconductor manufacturing processes are used, then manufacturing precision and device performance are improved, but compatibility with degradable materials and transient design deteriorates
Solution Approach 1:
The manufacturing process is segmented into two independent phases: Phase 1 uses conventional semiconductor manufacturing processes to fabricate permanent components with high precision on permanent substrates; Phase 2 uses gentle transfer printing processes to move these components onto transient substrates. This segmentation preserves the advantages of both approaches.
Solution Approach 2:
The release layer serves as a mediator that allows conventional semiconductor components to be decoupled from their permanent substrates and transferred to transient substrates. This intermediary enables the use of high-precision conventional processes while achieving compatibility with degradable materials through the transfer mechanism.
3Strength
If permanent substrates and encapsulants are used, then device strength and manufacturing reliability are improved, but transience and programmable degradation deteriorate
Solution Approach 1:
The device structure is segmented into permanent components (semiconductor devices, interlayer dielectrics) that provide structural integrity and transient components (substrate, encapsulant, interconnects) that provide controlled degradation. This segmentation allows the permanent parts to maintain strength while the transient parts control the device's useful lifetime.
Solution Approach 2:
The useful lifetime of the device is controlled by changing parameters of the transient materials - specifically the composition, thickness, and degradation rate of the substrate and encapsulant. By adjusting these parameters, the device can be programmed to degrade at specific rates while the permanent components maintain their structural and functional integrity throughout the device's operational life.
Data Source
AI summary
Provided are methods of making a transient electronic device by fabricating one or more inorganic semiconductor components, one or more metallic conductor components or one or more inorganic semiconductor components and one or more metallic conductor components supported by a mother substrate. The components may independently comprise a selectively transformable material and, optionally, further have a preselected transience profile. The components are transfer printed, thereby decoupling the component fabrication step from additional processing to provide desired device functionality and transient properties. A substrate layer is provided on top of the components and used to facilitate handling, processing, and/or device functionality.