Transient Temperature Monitoring for Power Device Hot Spot Prediction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing temperature monitoring systems for power devices, such as switchgear, provide only instantaneous temperature measurements, failing to predict potential thermal damage due to unanticipated heating during device operation, particularly after service tasks.
Innovation Solution
A system utilizing a temperature sensor, processing unit, and output unit to compare real-time measurements with pre-simulated transient temperature distributions from finite element analysis, enabling prediction of future hot spots and thermal stress through machine learning or matrix norm algorithms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If only instantaneous temperature measurements are used, then the measurement system remains simple, but the ability to predict future thermal damage and hot spot development is lost
Solution Approach 1:
The system performs preliminary actions by pre-calculating multiple simulated transient temperature distributions representing different operational scenarios before actual monitoring begins. These pre-computed reference distributions are stored and later used for comparison with real measurements, enabling predictive capability without real-time complex calculations
Solution Approach 2:
The system creates copies of temperature distributions through simulation - generating multiple virtual temperature distribution scenarios that represent different operational conditions. These simulated copies are then compared with actual measurements to predict future thermal behavior without requiring complex real-time physics calculations
2Loss of information
If temperature monitoring is performed only at instantaneous moments, then the measurement process remains simple, but the development of hot spots cannot be detected
Solution Approach 1:
The system implements feedback by comparing actual temperature measurements with simulated reference distributions, selecting the best matching scenario, and using that selection to predict future temperature development. This feedback loop transforms instantaneous measurements into predictive information about hot spot development
Solution Approach 2:
The simulated transient temperature distributions serve as intermediaries between instantaneous measurements and future temperature predictions. By comparing real measurements against these simulated intermediaries representing different operational scenarios, the system can infer future thermal development without directly measuring it
3Reliability
If the system waits for stationary state to assess thermal conditions, then measurement simplicity is maintained, but preventive action cannot be taken before damage occurs
Solution Approach 1:
The system performs preliminary action by predicting future temperature development during the transient heat-up phase before the stationary state is reached. By comparing current measurements with pre-computed simulated distributions, the system can forecast whether critical temperatures will be exceeded, enabling preventive action before damage occurs
Solution Approach 2:
The system embraces dynamics by monitoring temperature during the transient heat-up phase rather than waiting for stationary state. The method dynamically selects from multiple simulated transient distributions that represent different operational scenarios, enabling real-time predictive assessment throughout the entire thermal transient
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate prediction of future temperature development and potential thermal damage, allowing proactive fault detection and prevention in power devices.
Implementation Method 1
Temperature monitoring, for example using measurements with infrared (IR) sensors
Data Source
AI summary
A system and method for monitoring a device includes a temperature sensor, a processing unit, and an output unit. The temperature sensor acquires a temperature measurement during a heat-up phase of a component and provides a temperature measurement to the processing unit, which selects a simulated transient temperature distribution of the simulated component of the simulated device from a plurality of simulated transient temperature distributions of the simulated component of the simulated device. The selection comprises a comparison of the at least one temperature measurement with the plurality of simulated transient temperature distributions at an equivalent time point in the simulated heat-up to a time point at which the temperature measurement was acquired. When a hot spot is developing an output unit outputs an indication of a fault associated with the component.