Transient Thermal Diffusivity Measurement for Heat Dissipation Modules
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Solution Overview
Problem
Current methods for measuring thermal diffusion performance of heat dissipation modules lack specific and data-based technologies, relying on long-term measurements and failing to provide actionable insights for advanced heat sources like CPUs and LED light boards.
Innovation Solution
A method involving the determination of measurement points on a heat dissipation module's surface, temperature measurement, and calculation using energy equations to derive the thermal diffusivity coefficient, enabling precise assessment of transient thermal diffusion performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional long-term measurement methods are used, then measurement reliability is maintained, but measurement time is excessively long and productivity is low
Solution Approach 1:
The patent applies preliminary action by pre-defining the measurement points' locations on the heat dissipation module surface before actual measurement. The first measurement point is positioned at a first distance from a first edge, and the second measurement point is positioned at a second distance from a second edge, with these positions determined in advance based on geometric relationships rather than during the measurement process. This pre-positioning eliminates time-consuming location determination during measurement while ensuring measurement reliability through consistent, reproducible point selection.
2Adaptability or versatility
If measurement points are arbitrarily selected, then measurement flexibility is improved, but measurement precision and reproducibility deteriorate
Solution Approach 1:
The patent applies local quality by defining specific measurement locations based on local geometric features of the heat dissipation module. The first measurement point is located at a first distance from a first edge of the module, and the second measurement point is located at a second distance from a second edge. These positions are determined by local edge references rather than arbitrary selection, ensuring that measurement points are consistently positioned relative to the module's geometry. This approach maintains measurement flexibility for different module sizes while achieving precision through standardized local positioning rules.
3Ease of operation
If simple measurement approaches are used, then ease of operation is improved, but measurement precision and data reliability deteriorate
Solution Approach 1:
The patent applies mechanics substitution by replacing complex physical measurement systems with a computational approach. Instead of using complicated measurement apparatus or long-term observation methods, the patent measures temperatures at two specifically positioned points and calculates the thermal diffusivity coefficient through mathematical relationships. The thermal diffusivity coefficient is derived from temperature differences and distances between measurement points using established heat conduction equations, substituting complex thermal field measurement with a simplified two-point measurement and calculation system that maintains precision while improving ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides specific, data-based measurement results allowing users to evaluate the thermal performance of heat dissipation modules effectively, addressing the inadequacies of existing methods by offering a quantifiable measure of thermal diffusivity.
Implementation Method 1
The metal base plate is affixed to a heat source to provide the heat source with a way to conduct heat dissipation sideways or upward through the heat dissipation fins
Implementation Method 2
the temperature of the first measurement point and the second measurement point are measured under a stable heat source
Implementation Method 3
The metal base plate is affixed to a heat source to provide the heat source with a way to conduct heat dissipation sideways or upward through the heat dissipation fins
Data Source
AI summary
A method to measure the transient thermal diffusivity performance of a heat dissipation module by selecting two measurement points on the surface of the heat dissipation module, and locating the two measurement points at the same side of the thermal center point but different distances, and measuring the temperature of the two measurement points separately and using first equation which is the analytical solution of the energy equation. After calculating the first equation, second and third equations are used to find M. The distance X1 between M and the first measurement point and temperature T1 at a moment of transient state are also inserted into the first equation to obtain the value of the thermal diffusivity coefficient α, which represents the transient thermal diffusivity performance for the heat dissipation module.