Transient Voltage Suppressor With Multi-Well Structure

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Solution Overview

Problem

Conventional transient voltage suppressors have complex structures and difficulty in reducing overall resistance due to current concentration in a single path during electrostatic discharge events, which can lead to damage and high clamping voltage.

Innovation Solution

A transient voltage suppressor design featuring a substrate with multiple wells and electrodes, including a gap between the second and third wells that diffuse to form a gourd-like structure, allowing for a second current path to reduce overall resistance, and a heavily-doped region to adjust trigger voltage and on-resistance, with a floating doped region to prevent overheating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a gate structure is used to control turn-on voltage, then the turn-on voltage can be controlled, but the structure becomes complicated

Engineering Contradiction:
Improveturn-on voltage controlVSAvoidstructure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent removes the gate structure from the transient voltage suppressor device, eliminating the source of structural complexity while maintaining voltage control functionality through the breakdown voltage mechanism of the semiconductor junctions

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent controls turn-on voltage by adjusting doping concentrations and well dimensions rather than using a gate structure, changing the control mechanism from electrical gating to material parameter optimization

Inventive Principle:
Principle #35Parameter changes

2Reliability

If current flows through a single path, then the device structure is simple, but the overall resistance cannot be reduced

Engineering Contradiction:
Improveoverall resistanceVSAvoidcurrent path structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the current conduction path into multiple parallel paths by creating separate well structures (first well, second well, third well) that provide independent current flow routes, thereby reducing overall resistance without significantly increasing structural complexity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single-dimensional current path to a multi-dimensional current distribution by utilizing vertical well structures and lateral diffusion connections, creating a three-dimensional current flow network that reduces resistance

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design simplifies the structure by eliminating the gate electrode, reduces on-resistance through adjustable gap and doping concentrations, and effectively shunts current to prevent overheating and lower overall resistance during electrostatic discharge events.

Implementation Method 1

The second well and the third well are diffused to connect each other on the gap

Methodology Applied
Scientific EffectDiffusion: Diffusion

Implementation Method 2

The doped region is electrically connected with the first well and the third well respectively

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10607983B2Transient voltage suppressor
Publication Date: 2020.03.31 UPI SEMICON CORP
  • US10607983B2 patent drawing
  • US10607983B2 patent drawing
  • US10607983B2 patent drawing

AI summary

A transient voltage suppressor includes a substrate, a first well, a second well, a third well, a first electrode, a second electrode and a doped region. The first well is formed in the substrate and near a surface of the substrate. The second well is formed in the first well and near the surface. The third well is formed in the first well and near the surface. There is a gap between the second well and the third well. The first electrode and second electrode are formed in the second well and near the surface respectively. The first well and first electrode have a first electrical property. The second well, third well and second electrode have a second electrical property. The doped region is formed between the first electrode and second electrode and near the surface and electrically connected with the first well and third well.