Transistor Carrier Cooling With Resilient Contact Pressure
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Solution Overview
Problem
High-power MOSFETs in electric motor inverters generate excessive heat due to inherent resistance and switching actions, exacerbated by high ambient temperatures, leading to thermal stress and reduced reliability, necessitating effective cooling solutions to maintain performance and safety.
Innovation Solution
A system utilizing resilient members to apply a positive force on switching transistors, pressing them against a cooling surface, combined with a coolant pocket and rigid members to enhance thermal coupling and reduce noise, vibration, and electrical hazards in high-voltage applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-power MOSFETs are used for high power and high efficiency, then power output is improved, but heat generation increases leading to thermal stress and reduced reliability
Solution Approach 1:
The patent converts the harmful heat generated by MOSFET operation into a beneficial thermal management opportunity by implementing a direct thermal coupling system where the transistor case is pressed against a cooling surface, transforming waste heat into a controllable thermal flow that protects component reliability while maintaining high power output
Solution Approach 2:
The patent introduces resilient members as intermediaries between the MOSFET and cooling surface, providing a mechanical mediator that ensures consistent thermal contact while accommodating thermal expansion and contraction, thereby maintaining reliable thermal coupling under varying operating conditions
2Volume of moving object
If MOSFETs are placed in close proximity to turbocharger and exhaust pipes for compact design, then space utilization is improved, but ambient temperature increases worsening thermal management
Solution Approach 1:
The patent applies local quality by providing enhanced cooling specifically at the MOSFET location through direct thermal coupling to a cooling surface, creating a localized low-temperature zone around the transistor while maintaining compact overall system volume and proximity to heat-generating components like the turbocharger
3Temperature
If cooling pressure is increased to improve thermal coupling, then heat dissipation is improved, but mechanical stress and noise increase
Solution Approach 1:
The patent changes the mechanical parameter from rigid high-force pressing to compliant resilient member-based contact, allowing adequate thermal coupling pressure to be applied without generating excessive noise and vibration, while still achieving effective heat dissipation through the transistor case-to-cooling-surface interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management, improves reliability and safety by maintaining optimal transistor cooling, reducing noise and vibration, and preventing electrical breakdowns in compact, high-temperature environments.
Implementation Method 1
pressing them against a cooling surface to enhance thermal coupling
Implementation Method 2
resilient members to apply a positive force on a first surface of a switching transistor
Data Source
AI summary
A low loss power inverter including a printed circuit board having an upper surface, a lower surface and an internal layer disposed between the lower surface and the upper surface, a first transistor, disposed on the upper surface, having a first terminal, a second transistor, disposed on the upper surface, having a second terminal, and a decoupling capacitor having a first capacitor terminal conductively coupled to the first terminal via a first trace laminated to the upper surface and a second capacitor terminal conductively coupled to the second terminal via a second trace laminated to the lower surface.