Transistor Drift Region Doping for Breakdown and On-Resistance
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Solution Overview
Problem
The semiconductor industry faces challenges in producing high voltage transistors with both high breakdown voltage and low on-resistance, often requiring a large number of processing steps that increase costs.
Innovation Solution
A semiconductor device with a drift region formed into multiple carrier charge zones and carrier adjustment regions, using fewer processing steps to achieve a uniform electric field and reduced on-resistance, including a method of forming these zones with varying doping concentrations and counter-doping techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If various doped regions are formed to achieve high breakdown voltage and low on-resistance, then the transistor performance is improved, but the number of processing steps increases
Solution Approach 1:
The drift region is segmented into multiple zones (first zone, second zone, third zone) with different doping concentrations, allowing each zone to contribute differently to breakdown voltage and on-resistance. This segmentation enables achieving both high breakdown voltage and low on-resistance within a single integrated structure rather than requiring separate doped regions formed through multiple processing steps.
Solution Approach 2:
Different zones within the drift region have different doping concentrations tailored to their specific functions: the first zone has a first doping concentration, the second zone has a second doping concentration, and the third zone has a third doping concentration. This local quality variation allows optimization of both breakdown voltage and on-resistance properties in different spatial regions without requiring additional processing steps.
2Reliability
If various doped regions are formed to achieve high breakdown voltage and low on-resistance, then the transistor performance is improved, but the manufacturing cost increases
Solution Approach 1:
The drift region is segmented into multiple zones (first zone, second zone, third zone) with different doping concentrations, allowing each zone to contribute differently to breakdown voltage and on-resistance. This segmentation enables achieving both high breakdown voltage and low on-resistance within a single integrated structure rather than requiring separate doped regions formed through multiple processing steps.
Solution Approach 2:
Different zones within the drift region have different doping concentrations tailored to their specific functions: the first zone has a first doping concentration, the second zone has a second doping concentration, and the third zone has a third doping concentration. This local quality variation allows optimization of both breakdown voltage and on-resistance properties in different spatial regions without requiring additional processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of processing steps, lowering costs while achieving improved breakdown voltage and on-resistance performance by creating a uniform electric field and optimizing carrier distribution across the transistor.
Implementation Method 1
achieving improved breakdown voltage and on-resistance performance by creating a uniform electric field
Implementation Method 2
optimizing carrier distribution across the transistor
Implementation Method 3
drift region formed into multiple carrier charge zones with varying doping concentrations
Data Source
AI summary
In one embodiment, a transistor has a drift region that is formed to have a plurality of zones having different vertical doping profiles across the zones. At least one of the zones has a vertical doping profile that has a first peak near a top surface of the zone and a second peak near a bottom surface. An embodiment may have a lower doping in a region that is between the two peaks.


