Universal Transistor Heat Dissipation Module With Elastic Member

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Solution Overview

Problem

The existing heat dissipation solutions for transistors require custom designs and assembly processes for each transistor shape, leading to increased costs and potential operational errors due to the need for various heat dissipation members and assembly jigs.

Innovation Solution

A transistor heat dissipation module comprising a heat dissipation member with a flexible elastic member that accommodates transistors of different sizes, allowing for universal assembly and effective heat dissipation by pressing transistors against a second wall, while using a single assembly method and reducing the need for multiple assembly jigs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If custom heat dissipation members are designed for each transistor shape, then heat dissipation effectiveness is improved, but device complexity and manufacturing costs increase

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidheat dissipation member variety

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation member is designed with a universal structure comprising a first wall, second wall, and at least one connecting member that can accommodate multiple transistor shapes and sizes. The elastic member pressed between the first wall and transistor ensures consistent contact pressure for effective heat dissipation across different transistor configurations, eliminating the need for custom-designed heat dissipation members for each transistor type.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The heat dissipation member utilizes an elastic member with adjustable elasticity parameters to adapt to different transistor sizes and shapes. By changing the elastic properties and positioning of the elastic member, the system maintains effective heat dissipation contact pressure across varying transistor configurations without requiring multiple specialized heat dissipation members.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If multiple assembly jigs are used for different heat dissipation members, then assembly precision is improved, but loss of time and productivity decrease

Engineering Contradiction:

Improveassembly precisionVSAvoidassembly speed

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

A single assembly jig is designed to accommodate the universal heat dissipation member structure, eliminating the need for multiple specialized jigs. The jig includes positioning structures for the first wall, second wall, and connecting members, allowing precise assembly of the heat dissipation member with different transistors using the same tooling, thereby improving productivity while maintaining assembly precision.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Manufacturing precision

If multiple assembly processes are required for different transistors, then assembly precision is improved, but loss of time and operational error risk increase

Engineering Contradiction:

Improveassembly consistencyVSAvoidassembly process time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

A standardized assembly process is established for the universal heat dissipation member that can be applied to all transistor types. The process involves placing the transistor between the first and second walls, inserting the elastic member to ensure proper contact, and securing the connecting members. This single standardized process reduces assembly time and minimizes operational errors compared to multiple specialized processes, while maintaining consistent assembly precision through the universal design.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient heat dissipation for transistors of varying sizes with a single assembly method, reducing costs and lowering defective rates caused by operational errors, as the flexible elastic member ensures consistent contact with the heat dissipation member.

Implementation Method 1

an elastic member (130) is disposed in the accommodating space (111) and is located between the at least one transistor (10) and the first wall (115a) to press the at least one transistor (10) against the second wall (115b)

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

a heat dissipation member (110) includes a first wall (115a) and a second wall (115b) opposite to each other

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11482469B2Transistor heat dissipation module and assembly method thereof

Publication Date: 2022.10.25 LITE ON ELECTRONICS (GUANGZHOU) LTD

AI summary

A transistor heat dissipation module is adapted for at least one transistor. The transistor heat dissipation module includes a heat dissipation member and an elastic member. The heat dissipation member includes a first wall and a second wall opposite to each other and a first connecting member connected to the first wall and the second wall. An accommodating space is formed between the first wall and the second wall. The transistor is disposed in the accommodating space. The elastic member is disposed in the accommodating space and is located between the at least one transistor and the first wall to press the at least one transistor against the second wall. An assembly method of a transistor heat dissipation module is further provided.