Transistor and Lowpass Filter for Liquid Ejecting Apparatus

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing liquid ejecting apparatuses face challenges in achieving high-speed and high-resolution printing due to energy efficiency issues and noise-related problems when increasing the switching frequency of class D amplification, leading to potential erroneous operations and heat generation.

Innovation Solution

A liquid ejecting apparatus with a modulation circuit, transistor, and lowpass filter configuration that suppresses voltage noise and enhances heat dissipation, allowing for increased frequency of the driving signal applied to piezoelectric elements, thereby enabling high-speed and high-resolution printing while maintaining efficient power consumption and heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the switching frequency of class D amplification is increased to increase the driving signal frequency for high-speed printing, then the ink ejection frequency increases, but the switching loss increases and energy efficiency deteriorates

Engineering Contradiction:
Improveink ejection frequencyVSAvoidswitching loss
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The patent changes the electrical parameters of the transistor by selecting specific electrode configurations (drain electrode width, source electrode width, channel length) to optimize the balance between switching frequency capability and switching loss, enabling high-speed printing while maintaining energy efficiency

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements dynamic control of the driving signal frequency based on printing conditions, adjusting the switching frequency of the class D amplification to match the required ink ejection frequency while minimizing switching losses through adaptive parameter adjustment

Inventive Principle:
Principle #15Dynamics

2Manufacturing precision

If the switching frequency of class D amplification is increased to achieve high-resolution printing, then the driving signal frequency increases, but noise and heat generation increase causing erroneous operations

Engineering Contradiction:
Improveprinting resolutionVSAvoidnoise and heat
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an intermediary low-pass filter between the class D amplification output and the piezoelectric element input to suppress high-frequency noise while preserving the necessary driving signal components, enabling high-resolution printing without erroneous operations

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent converts the inherent switching noise of class D amplification into a beneficial filtering opportunity by using the low-pass filter to remove harmful high-frequency components while maintaining the useful mid-frequency components needed for high-resolution printing

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Speed

If the driving signal frequency is increased for high-speed printing, then the ink ejection frequency increases, but the switching loss in class D amplification increases reducing energy efficiency

Engineering Contradiction:
Improveprinting speedVSAvoidpower consumption
Core Design Contradiction:
SpeedVSUse of energy by moving object

Solution Approach 1:

The patent optimizes transistor parameters (electrode dimensions, channel length) to reduce switching loss at high frequencies, enabling high-speed printing with improved power efficiency by changing the electrical characteristics of the amplification circuit

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves high-speed and high-resolution printing by increasing the frequency of the driving signal without compromising energy efficiency or leading to erroneous operations, thanks to the suppression of voltage noise and improved heat dissipation.

Implementation Method 1

a piezoelectric element that is displaced when the driving signal is applied

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

a transistor that amplifies the modulated signal to generate an amplified modulated signal

Methodology Applied
Scientific EffectElectrical amplification:

Implementation Method 3

a lowpass filer that smoothes the amplified modulated signal to generate a driving signal

Methodology Applied
Scientific EffectSignal filtering: Filter (electronic)

Implementation Method 4

Heat generated in the die transfers to the circuit substrate via the die pad guiding the first electrode to the printed circuit substrate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9656461B2Liquid ejecting apparatus, head unit, and method of controlling liquid ejecting apparatus
Publication Date: 2017.05.23 SEIKO EPSON CORP
  • US9656461B2 patent drawing
  • US9656461B2 patent drawing
  • US9656461B2 patent drawing

AI summary

A liquid ejecting apparatus includes: a modulation circuit that generates a modulated signal obtained by performing pulse modulation on a source signal; a transistor that amplifies the modulated signal to generate an amplified modulated signal; a lowpass filer that smoothes the amplified modulated signal to generate a driving signal; a piezoelectric element that is displaced when the driving signal is applied; and a circuit substrate on which the modulation circuit, the transistor, and the lowpass filter are mounted. The transistor includes a die, a first electrode, a second electrode, a third electrode, a conductive die pad, a first lead which is electrically connected to the second electrode by a bonding wire, and a second lead which is electrically connected to the third electrode by a bonding wire. The die pad, the first lead, and the second lead are electrically connected to different wiring patterns of the circuit substrate.