Transistor Modeling Using Machine Learning to Predict Electrical Test Data

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Solution Overview

Problem

Conventional transistor modeling methods face challenges with consistency issues due to process distribution and variation, increased turnaround time, and additional costs caused by limited sample sizes and extensive testing.

Innovation Solution

A computing device and transistor modeling apparatus that utilize machine learning on mass electrical test data to predict and generate representative electrical test data, reducing the need for extensive measurements and improving product representativeness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If extensive electrical testing is performed on actual product samples to establish device models, then modeling accuracy is improved, but turnaround time increases and cost scrap increases

Engineering Contradiction:
Improvemodeling accuracyVSAvoidturnaround time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent creates a virtual copy of the electrical testing process through machine learning models. Instead of physically testing each sample, the system trains ML models on existing test data to predict electrical characteristics, effectively copying the testing function in silico. This allows rapid generation of model parameters without repeated physical measurements.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The system performs preliminary machine learning training on historical test data before actual modeling is needed. By pre-training models on existing electrical test data, the system prepares predictive capabilities in advance, so that when new device data arrives, the modeling can be performed rapidly without waiting for extensive new measurements.

Inventive Principle:
Principle #10Preliminary action

2Measurement precision

If extensive electrical testing is performed on actual product samples to establish device models, then modeling accuracy is improved, but cost scrap increases

Engineering Contradiction:
Improvemodeling accuracyVSAvoidcost scrap
Core Design Contradiction:
Measurement precisionVSLoss of substance

Solution Approach 1:

The patent replaces physical testing with virtual testing through machine learning. Instead of requiring actual product samples to be tested and potentially discarded, the system creates digital twins through ML predictions, eliminating the need for physical test samples and associated scrap costs.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The system uses existing test data and machine learning algorithms to generate modeling data autonomously, without requiring additional physical testing resources. The ML models self-generate predictions based on training data, eliminating the need for costly physical testing infrastructure and sample materials.

Inventive Principle:
Principle #25Self-service

3Loss of substance

If limited sample sizes are used for electrical testing, then testing cost is reduced, but representativeness of data deteriorates

Engineering Contradiction:
Improvetesting costVSAvoidrepresentativeness
Core Design Contradiction:
Loss of substanceVSMeasurement precision

Solution Approach 1:

The patent uses machine learning to generate virtual copies of test data that represent the full distribution of possible device characteristics. Instead of physically testing limited samples, the system creates synthetic data through ML models trained on existing data, generating representative samples that capture process variations without requiring proportional physical testing.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The system transforms physical test parameters into predictive model parameters through machine learning. By changing from direct physical measurements to ML-predicted parameters, the system can generate representative data for modeling without being constrained by the limited size of physical test samples, effectively expanding the data representation capability.

Inventive Principle:
Principle #35Parameter changes

4Measurement precision

If process distribution and variation are considered in device modeling, then modeling accuracy is improved, but consistency issues arise

Engineering Contradiction:
Improvemodeling accuracyVSAvoiddata consistency
Core Design Contradiction:
Measurement precisionVSStability of the object's composition

Solution Approach 1:

The patent implements feedback loops where machine learning models continuously refine their predictions based on comparing predicted values against actual test data. This feedback mechanism allows the system to learn from discrepancies and adjust model parameters, achieving consistency in the face of process variations while maintaining accuracy.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system changes the approach from directly modeling physical parameters subject to variation to modeling transformed parameters through machine learning. By using ML to map from physical measurements to model parameters, the system creates a more stable transformation that handles process distribution and variation, improving both accuracy and consistency.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20230105438A1Computing device for predicting data for transistor modeling, transistor modeling apparatus having the same, and operating method thereof
Publication Date: 2023.04.06 SAMSUNG ELECTRONICS CO LTD
  • US20230105438A1 patent drawing
  • US20230105438A1 patent drawing
  • US20230105438A1 patent drawing

AI summary

A method of operating a transistor modeling apparatus includes acquiring sample data corresponding to transistor modeling through a test device; performing machine learning on the sample data and first electrical test (ET) data of a transistor mass production stage; generating second ET data for the transistor modeling as a result of performing the machine learning; and setting a representative value for the transistor modeling among the second ET data.