In-Transit UV Irradiation for Wafer Adhesive Debonding

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Solution Overview

Problem

Existing technologies fail to efficiently irradiate semiconductor wafers and resin-sealed package substrates with ultraviolet rays during chip manufacturing, leading to reduced adhesive bonding power and decreased production efficiency due to the need for separate irradiation steps, which prolong processing times.

Innovation Solution

An ultraviolet irradiation system and method that integrates ultraviolet emitters into the delivery path between processing apparatuses, allowing continuous irradiation of delivery targets while in transit, using a delivery carriage with a transmissive receptacle and controlled irradiation times to ensure efficient adhesive curing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If ultraviolet irradiation is performed as a separate step before peeling the adhesive tape, then the bonding power of the adhesive is reduced, but the production efficiency decreases due to prolonged processing time

Engineering Contradiction:
Improveadhesive bonding powerVSAvoidproduction efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The ultraviolet irradiation function is merged with the delivery path between processing apparatuses. The ultraviolet irradiator is integrated into the delivery carriage, allowing irradiation to occur during transit rather than requiring a separate stationary irradiation step. This combines the delivery function with the irradiation function, eliminating idle time and improving production efficiency while maintaining adhesive debonding capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The delivery carriage equipped with the ultraviolet emitter enables continuous irradiation during the entire delivery process from the cutting apparatus to the bonding apparatus. Instead of intermittent irradiation at separate steps, the useful action of irradiation continues throughout transit, ensuring the adhesive bonding power is reduced at the optimal moment without interrupting the production flow.

Inventive Principle:
Principle #20Continuity of useful action

2Ease of operation

If the delivery target is unloaded and loaded between processing steps, then the processing sequence is maintained, but the handling time increases

Engineering Contradiction:
Improveprocessing sequenceVSAvoidhandling time
Core Design Contradiction:
Ease of operationVSLoss of time

Solution Approach 1:

The delivery carriage is designed to perform multiple functions autonomously during transit: it delivers the delivery target between apparatuses, provides ultraviolet irradiation during delivery, and positions the target for subsequent processing. This self-service capability eliminates the need for separate unloading and loading operations at intermediate steps, reducing handling time while maintaining proper processing sequence through integrated control.

Inventive Principle:
Principle #25Self-service

3Ease of operation

If a frame unit with adhesive tape is used to hold the workpiece, then the workpiece can be handled easily, but the adhesive bonding power is reduced when irradiated with ultraviolet rays

Engineering Contradiction:
Improvehandling easeVSAvoidadhesive bonding power
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The ultraviolet irradiation is applied at the precise moment before the adhesive tape needs to be peeled off, rather than continuously or too early. The delivery carriage controls the timing of irradiation to coincide with the transition point where the adhesive bonding power needs to be reduced, maintaining strong bonding during handling and transport while enabling easy peeling when needed.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances production efficiency by allowing simultaneous irradiation and processing, reducing handling times and maintaining adhesive bonding power, thereby improving the throughput of semiconductor wafer processing.

Implementation Method 1

an ultraviolet emitter for emitting ultraviolet rays

Methodology Applied
Scientific EffectUltraviolet irradiation: Light

Implementation Method 2

The adhesive may be of a material that is curable when it absorbs light having a particular wavelength, such as ultraviolet rays. If a holdable target such as a semiconductor wafer is held on an adhesive tape including such an adhesive, then the bonding power of the adhesive is lowered when it is irradiated with ultraviolet rays.

Methodology Applied
Scientific EffectPhotodegradation of adhesive: Photopolymerisation

Data Source

PatentUS20250379071A1Ultraviolet irradiation system, ultraviolet irradiation method, and method of manufacturing chips
Publication Date: 2025.12.11 DISCO CORP
  • US20250379071A1 patent drawing
  • US20250379071A1 patent drawing
  • US20250379071A1 patent drawing

AI summary

An ultraviolet irradiation system irradiates a delivery target with ultraviolet rays. The ultraviolet irradiation system includes a delivery path along which to deliver the delivery target to a treatment apparatus and an ultraviolet irradiator for irradiating the delivery target delivered along the delivery path with ultraviolet rays, in which the ultraviolet irradiator is disposed in the delivery path and includes an ultraviolet emitter for emitting ultraviolet rays.