Transition Zone for Embedding Electronics in Metal Additive Manufacturing

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Solution Overview

Problem

Metal parts cannot integrate embedded electronics due to high processing temperatures required for their implementation, which destroy the circuitry of the electronics.

Innovation Solution

An additive manufacturing product with a transition zone made of material having an intermediate melting point, compatible with both embedded electronics and metal materials, is used to encase the electronics, allowing bonding with the metal base material without damaging the electronics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If high processing temperatures are used to implant embedded electronics into metal parts, then the electronics can be integrated into metal parts, but the high processing temperatures destroy the circuitry of the embedded electronics

Engineering Contradiction:

Improveintegration of embedded electronics into metal partsVSAvoiddamage to electronics from high temperature

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

A transition zone material with intermediate melting point is introduced as an intermediary between the embedded electronics and the metal base material. This transition zone allows the electronics to be implanted at lower temperatures that do not damage the circuitry, while still enabling integration with the metal parts through the intermediate layer.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The melting point parameter of the transition zone material is specifically selected to be intermediate between the electronics tolerance and metal base material melting point. This parameter change enables the process to occur at temperatures compatible with electronics while maintaining ability to bond with metal.

Inventive Principle:

Principle #35Parameter changes

2Object-affected harmful factors

If transition zone material with intermediate melting point is used, then the embedded electronics are protected from high temperature damage, but the processing temperature is reduced limiting bonding capability

Engineering Contradiction:

Improveprotection of electronics from high temperatureVSAvoidbonding strength between transition zone and metal base material

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The transition zone material is designed as a composite or alloy that combines properties of both the electronics-compatible material and the metal base material. This composite structure enables bonding with the metal base material while maintaining compatibility with the embedded electronics through its intermediate melting point.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The transition zone material's melting point parameter is optimized to enable bonding at reduced temperatures. By changing the material composition to achieve this intermediate melting point, the system can form strong bonds with the metal base material without requiring temperatures that would damage the electronics.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the integration of sensors and circuitry into both plastic and metal parts, reducing packaging and enhancing equipment performance and prognostics by protecting the electronics from high-temperature processing.

Implementation Method 1

The transition material includes an intermediate melting point that is lower than a melting point of the base material

Methodology Applied

Scientific EffectMelting: Melting

Data Source

PatentUS11833590B2Embedded electronics in metal additive manufacturing builds enabled by low-melting temperature transition zone using material gradients

Publication Date: 2023.12.05 HAMILTON SUNDSTRAND CORP

AI summary

An additive manufacturing product is provided. The additive manufacturing product includes an embedded electronic, a transition zone, and a base material. The transition zone encases the embedded electronic. The transition zone includes transition material. The base material encases the transition zone. The transition material includes an intermediate melting point that is lower than a melting point of the base material.