Transitional Layer for Electronic Modules Preventing Bending Damage
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Solution Overview
Problem
Conventional producing processes for integrated circuit cards are prone to high costs due to the ease with which electronic modules can be bent and damaged during processing, leading to inefficiencies and component damage.
Innovation Solution
A transitional layer comprising a substrate with containing holes, multiple electronic modules with input elements, and two release papers mounted via adhesive coats, which protects the modules from bending and allows for direct programming and packaging, reducing the risk of damage and improving processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic modules are processed individually in conventional producing process, then programming can be performed on each module, but the modules are easy to be bent and damaged during handling
Solution Approach 1:
Multiple electronic modules are mounted together on a single substrate to form an assembly, treating multiple fragile components as one unified structure. This merging approach allows the modules to support each other mechanically, preventing bending and damage during subsequent processing operations while maintaining the ability to program each module individually through access holes in the mounting plate.
Solution Approach 2:
The electronic modules are mounted on the substrate before the programming operation. By performing the mounting action in advance, the modules are secured in a protected configuration that prevents damage during handling and transport to the programming station, while still allowing access for code embedding through the plate's access holes.
2Manufacturing precision
If individual processing is used, then each module can be programmed, but the production cost increases due to damage risks
Solution Approach 1:
Multiple modules are processed simultaneously as an assembly rather than individually. The mounting plate with access holes enables programming operations to be performed on multiple modules in parallel or in a streamlined sequence, reducing the total number of handling operations and minimizing damage risks while maintaining programming accuracy for each module.
Solution Approach 2:
The substrate with access holes serves as an intermediary structure that holds multiple modules during processing. This mediator allows programming equipment to access individual modules through the holes while the modules remain protected by their collective mounting arrangement, enabling efficient batch processing without compromising programming precision.
3Ease of operation
If modules are handled separately, then programming access is direct, but the modules are vulnerable to bending damage
Solution Approach 1:
Multiple modules are combined into an assembly mounted on a rigid substrate, providing mutual mechanical support that increases resistance to bending forces. The substrate acts as a strengthening backbone that distributes stresses across the entire assembly, protecting individual modules from bending damage while access holes in the substrate maintain direct programming access to each module's interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The transitional layer effectively prevents electronic module damage and reduces production costs by providing a protective and packaging solution for the modules during processing, enabling efficient embedding of programmed codes and integration into integrated circuit cards.
Implementation Method 1
The two release papers are respectively mounted to the substrate and the multiple electronic modules via an adhesive coat on two different sides of the substrate
Data Source
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AI summary
A transitional layer for electronic modules (A) has a substrate (10), multiple electronic modules (20), and two release papers (30, 40). The two release papers (30, 40) package the multiple electronic modules (20) in the substrate (10), and protect the electronic modules (20). A user may directly embed programmed codes into the electronic modules (20) via a chip (21) or a fingerprint identification element (23) through one of the two release papers (40) with operation holes (42). Therefore, the multiple electronic modules (20) may be prevented from being bended and thereby damaged by the transitional layer for electronic modules (A). A producing method thereof is also provided.