Translucent Conductive Film with Protrusions and Colored Layer
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Solution Overview
Problem
Conventional translucent conductive films have a mesh pattern of metal wiring that is visually recognizable, leading to usability issues and potential wire breaks, necessitating an improvement in productivity and reliability.
Innovation Solution
A translucent conductive film with a film substrate having protrusions, a metal wiring layer with specific dimensions and geometry, and a colored layer configuration that absorbs light, reducing visual recognition and preventing wire breaks, while maintaining high productivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a metal wiring layer with narrow line width is used to reduce visual recognition, then the mesh pattern becomes less recognizable, but wire breaks occur more frequently reducing reliability
Solution Approach 1:
The patent optimizes the line width parameter to a specific range (5-8 μm) and thickness parameter (0.1-0.5 μm) to achieve the optimal balance between visual recognition and wire break prevention. By carefully controlling these geometric parameters, the metal wiring layer becomes less visually recognizable while maintaining sufficient mechanical strength to avoid breaks during handling and assembly.
2Reliability
If the metal wiring layer thickness is increased to prevent wire breaks, then reliability improves, but the mesh pattern becomes more visually recognizable
Solution Approach 1:
The patent specifies a thickness range of 0.1-0.5 μm for the metal wiring layer, which is sufficiently thick to prevent wire breaks during handling and assembly, yet thin enough to maintain low visual recognition when viewed from the front. This optimized thickness parameter resolves the contradiction between mechanical reliability and optical transparency.
3Device complexity
If a flat film substrate is used, then manufacturing is simpler, but wire breaks occur due to lack of stress distribution
Solution Approach 1:
The patent introduces protrusions with curved surfaces on the film substrate instead of a completely flat structure. These curved protrusions have heights of 0.1-3 μm that create stress distribution patterns, preventing wire breaks while maintaining relatively simple manufacturing processes. The curvature helps distribute mechanical stresses away from the metal wiring layer.
4Ease of manufacture
If the line width of metal wiring is decreased to improve transparency, then visual recognition reduces, but manufacturing precision requirements increase
Solution Approach 1:
The patent establishes a specific line width range of 5-8 μm that balances transparency requirements with manufacturing precision capabilities. This parameter range is narrow enough to provide good transparency and reduce visual recognition, yet wide enough to be manufactured with conventional precision control methods, avoiding excessive complexity in the manufacturing process.
Data Source
AI summary
A translucent conductive film includes a film substrate, a metal wiring layer provided as a pattern, and a colored layer. The film substrate has a plurality of protrusions on a surface at a side where the metal wiring layer is provided. The metal wiring layer has a line width of greater than 5 μm but less than 8 μm, and the metal wiring layer having a thickness of greater than or equal to 0.1 μm but less than 0.5 μm. The colored layer is provided on a main surface of the metal wiring layer at a viewing side but not on a side surface of the metal wiring layer.