Translucent Polyimide Film for High-Frequency Communication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional polyimide films lack sufficient low dielectric properties and transparency, making them unsuitable for high-frequency communication and transparent display applications while maintaining thermal stability and mechanical properties.
Innovation Solution
A method of manufacturing a polyimide film using a combination of conventional monomers, specifically by polymerizing a first and second dianhydride component with a diamine component in an organic solvent, followed by imidization, to achieve a dielectric dissipation factor of 0.003 or less and a haze value of 3.5% or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polyimide is used to maintain thermal stability and mechanical properties, then thermal stability is improved, but dielectric properties deteriorate (dielectric dissipation factor is too high for high-frequency communication)
Solution Approach 1:
The patent changes the chemical composition parameters of polyimide by using specific dianhydride components (ODPA, BPDA, PMDA, BTDA) combined with specific diamine components (PPD, ODA, TPE-R, TPE-Q, BAPP, DABA) to achieve both low dielectric dissipation factor (≤0.003) and maintained thermal stability
Solution Approach 2:
The patent creates a composite polyimide structure by combining multiple dianhydride components with multiple diamine components in specific ratios, resulting in a material that simultaneously achieves low dielectric properties and high thermal stability that neither component could achieve alone
2Illumination intensity
If methods to increase transparency (using weak electron acceptor dianhydride or weak electron donor diamine) are applied, then transparency is improved, but thermal stability and mechanical properties deteriorate
Solution Approach 1:
The patent changes the electronic structure parameters of polyimide by selecting specific dianhydride and diamine combinations that maintain conjugation and electron delocalization for transparency while preserving thermal stability through the rigid aromatic main chain structure
Solution Approach 2:
The patent applies local quality by maintaining different structural characteristics in different parts of the polymer chain - the aromatic main chain provides thermal stability while the side groups and conjugation patterns provide transparency, achieving both properties simultaneously
3Illumination intensity
If methods to increase transparency (introducing bulky substituents or asymmetric structures) are applied, then transparency is improved, but permittivity increases (dielectric properties deteriorate)
Solution Approach 1:
The patent changes the molecular weight and composition parameters by using specific dianhydride-diamine combinations that achieve transparency through conjugation rather than bulky substituents, thereby maintaining low permittivity while achieving the desired transparency
4Illumination intensity
If monomers with complex structures are used to achieve transparency, then transparency is improved, but raw material cost increases
Solution Approach 1:
The patent uses conventional, readily available monomers (ODPA, BPDA, PMDA, BTDA and PPD, ODA, TPE-R, TPE-Q, BAPP, DABA) that are cost-effective and easily manufactured, replacing expensive specialized monomers while achieving the same transparency through optimized combination and processing conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting polyimide film exhibits low dielectric dissipation, low haze, high light transmittance, and maintains thermal stability, making it suitable for high-frequency communication and transparent display applications while being cost-effective.
Implementation Method 1
preparing a polyamic acid by polymerizing a first dianhydride component, a second dianhydride component, and a diamine component in an organic solvent
Implementation Method 2
forming a film of a precursor composition containing the polyamic acid on a support and then imidizing the film
Data Source
AI summary
The present invention provides a polyimide film and a manufacturing method therefor, the polyimide film having a dielectric dissipation factor (Df) of 0.003 or less, a haze of 3.5% or less, a transmittance of 45% or greater, and a glass transition temperature (Tg) that is equal to or greater than 300° C. and is less than 320° C.