Translucent Sensor Package Structure for Smaller, More Reliable Assembly

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional semiconductor packages and manufacturing methods result in high costs, decreased reliability, and large package sizes, leading to suboptimal performance.

Innovation Solution

The use of a substrate with an electrically conductive material and a translucent mold compound, coupled with an electronic component and electrical interconnect, along with a translucent underfill material to provide protection and electrical coupling, while optimizing package size and performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor packages and manufacturing methods are used, then manufacturing experience and traditional processes are maintained, but costs are high, reliability is decreased, and package sizes are large

Engineering Contradiction:

ImprovereliabilityVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent segments the semiconductor package into distinct functional layers: a substrate layer, a first translucent material layer, an electronic component layer, a second translucent material layer, and an underfill material layer. This segmentation allows each layer to be optimized independently for its specific function while simplifying the overall manufacturing process and improving reliability through specialized material selection in each zone.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs composite material structures combining multiple translucent materials (first and second translucent materials) with different properties, along with an underfill material and electronic components. This composite approach enables simultaneous optimization of optical transmission, mechanical support, and electrical functionality, resolving the contradiction between reliability and ease of manufacture by integrating multiple functions into a unified structure.

Inventive Principle:

Principle #40Composite materials

2Productivity

If conventional semiconductor packages are used, then traditional package structures are maintained, but package sizes are too large leading to suboptimal performance

Engineering Contradiction:

ImproveperformanceVSAvoidpackage size

Core Design Contradiction:

ProductivityVSVolume of stationary object

Solution Approach 1:

The patent transitions from conventional lateral expansion of package structures to a vertical stacking architecture where electronic components are positioned above the substrate in the vertical dimension. This dimensional change enables high-density integration and improved performance while minimizing the horizontal footprint and overall package volume.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where the electronic component is positioned within a cavity formed by the substrate and translucent material layers, with the underfill material nested between the electronic component and the first translucent material. This nesting approach maximizes space utilization, reducing package size while maintaining optimal performance through precise component positioning.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Ease of manufacture

If conventional semiconductor packages are used, then traditional manufacturing approaches are maintained, but costs are excessive

Engineering Contradiction:

Improvemanufacturing costVSAvoidreliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent employs the substrate to perform multiple functions simultaneously: providing mechanical support, forming a base layer for optical transmission, and serving as a mounting platform for electronic components. The translucent materials also provide both structural encapsulation and optical transmission functions. This multi-functionality reduces the number of separate components needed, lowering manufacturing costs while maintaining high reliability through integrated design.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12176443B2Electronic sensor devices and methods of manufacturing electronic sensor devices

Publication Date: 2024.12.24 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device includes: an electronic component comprising a sensor and an electrical interconnect; a substrate comprising an electrically conductive material and a translucent mold compound, wherein the electrically conductive material is coupled to the translucent mold compound and wherein the electrical interconnect of the electronic component is coupled to the electrically conductive material of the substrate; and a translucent underfill contacting the electrical interconnect and between the translucent mold compound and the sensor. Other examples and related methods are also disclosed herein.