Translucent Underfill for Sensor Package Reliability

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing semiconductor packages and manufacturing methods are inadequate, resulting in excess cost, decreased reliability, relatively low performance, and package sizes that are too large.

Innovation Solution

The proposed solution involves an electronic device comprising an electronic component with a sensor and electrical interconnect, a substrate with an electrically conductive material and translucent mold compound, and a translucent underfill contacting the electrical interconnect and between the translucent mold compound and the sensor. The manufacturing method includes forming cavities in the conductive material, placing the electronic component, and forming translucent materials in these cavities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor packages are used, then manufacturing cost is reduced, but reliability decreases and performance is limited

Engineering Contradiction:

Improvepackage reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the physical and chemical parameters of the packaging materials by using translucent mold compound and translucent underfill materials with specific optical properties (translucency) and material characteristics that differ from conventional opaque materials, thereby improving reliability while maintaining manufacturability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures combining translucent mold compound, translucent underfill, and electronic components with electrical interconnects, creating a multi-material system that achieves enhanced reliability through material synergy rather than relying on single conventional materials

Inventive Principle:

Principle #40Composite materials

2Volume of stationary object

If conventional semiconductor packages are used, then manufacturing process is simplified, but package size becomes too large

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing process complexity

Core Design Contradiction:

Volume of stationary objectVSEase of manufacture

Solution Approach 1:

The patent merges the mold compound and underfill into a single translucent material system that serves both encapsulation and gap-filling functions simultaneously, reducing overall package volume while maintaining a relatively simple manufacturing process through integrated material functionality

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If conventional packages are used, then manufacturing cost is lower, but electrical coupling efficiency decreases

Engineering Contradiction:

Improveelectrical coupling reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the electrical and physical parameters of the interconnect system by using translucent materials with specific dielectric properties and conducting materials with optimized electrical characteristics, improving electrical coupling reliability while maintaining cost-effectiveness through parameter optimization rather than fundamental design changes

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20250133864A1Electronic sensor devices and methods of manufacturing electronic sensor devices

Publication Date: 2025.04.24 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device includes: an electronic component comprising a sensor and an electrical interconnect; a substrate comprising an electrically conductive material and a translucent mold compound, wherein the electrically conductive material is coupled to the translucent mold compound and wherein the electrical interconnect of the electronic component is coupled to the electrically conductive material of the substrate; and a translucent underfill contacting the electrical interconnect and between the translucent mold compound and the sensor. Other examples and related methods are also disclosed herein.