Transmission Cable Metal Bump Interlayer Connection
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Solution Overview
Problem
Existing transmission cables face high electrical and connection resistances due to conductive paste used in forming electrically-conductive bumps, leading to inadequate noise suppression and interference between signal lines, which complicates manufacturing and increases costs.
Innovation Solution
A transmission cable design featuring a metal bump formed by etching copper foil for interlayer connections between the ground line and shield layer, utilizing existing wiring circuit board manufacturing processes to simplify production and reduce costs, while ensuring low resistance and effective noise suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive paste is used to form electrically-conductive bumps for interlayer connections, then the manufacturing process can be simplified, but the electrical resistance and connection resistance increase, leading to insufficient noise suppression
Solution Approach 1:
The patent changes the material parameter of the bump from conductive paste to metal material, fundamentally altering the electrical resistance characteristic. This parameter change resolves the contradiction by achieving low electrical resistance while maintaining manufacturing feasibility through established metal bump formation techniques
Solution Approach 2:
The patent employs a metal bump formation process that uses inexpensive metal materials and standard manufacturing techniques rather than expensive conductive paste formulations. The metal bump serves as a durable, low-resistance connection that eliminates the need for complex paste application and curing processes
2Ease of manufacture
If conductive paste is used to form electrically-conductive bumps, then the manufacturing process becomes simpler, but the connection resistance with copper foil increases, reducing shield effectiveness
Solution Approach 1:
The patent changes the material parameter from conductive paste to metal, which fundamentally improves the connection resistance characteristic. Metal-to-copper foil connections provide superior electrical contact compared to paste-based connections, resolving the contradiction between manufacturing simplicity and connection quality
Solution Approach 2:
The patent employs a composite structure where metal bump material is integrated with copper foil ground lines and insulation layers. This composite approach ensures low connection resistance at the metal-copper interface while maintaining the insulating properties of surrounding materials, achieving both ease of manufacture and high reliability
3Device complexity
If ground line is arranged between signal lines with high resistance connections, then the structure provides basic shielding, but noise and interference between signal lines cannot be sufficiently suppressed
Solution Approach 1:
The patent changes the electrical resistance parameter of the interlayer connection by using metal bumps instead of conductive paste. This parameter change enables the ground line to function effectively as a shield by providing low-resistance pathways for noise current, thereby suppressing electromagnetic interference between signal lines while maintaining structural simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves low electric resistance and connection resistance, effectively functioning as a shield to suppress noise and interference, enabling fast and large-capacity data transfer with reduced manufacturing complexity and cost.
Implementation Method 1
the ground line is electrically connected to the shield layer via the metal bump
Implementation Method 2
a shield layer formed on a back surface side of the insulation layer... effectively functioning as a shield to suppress noise and interference
Data Source
AI summary
A transmission cable includes multiple signal lines formed on one side of an insulation layer and a ground line between the signal lines. The ground line is electrically connected to a shield layer formed on a back surface side of the insulation layer and to a noise suppressing layer having a high electric resistance value than the shield layer via a metal bump embedded and formed in the insulation layer. The noise suppressing layer has a function to suppress an unwanted emission and/or a noise and has a function as an etching barrier layer serving as an etching stopper in a step for forming the metal bump. Thus, the transmission cable can suppress an increase of an electric resistance and a connection resistance between the ground line and the shield layer.