Transmission Control Module Fluid-Tight PCB Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing transmission control modules face challenges in integrating a transmission control circuit with electrical components in a compact and fluid-tight manner, as conventional printed circuit boards are exposed to aggressive transmission fluids, requiring new construction and connection concepts to protect electrical connections and components.
Innovation Solution
A transmission control module using a ceramic LTCC or microprinted circuit board as a carrier substrate with conductor tracks, where the carrier substrate is inserted into a recessed area of the printed circuit board and sealed with a molding compound to protect against transmission fluid, allowing for compact and reliable integration of electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional printed circuit board is used as the base support for electrical connections in the transmission control module, then the module can be produced inexpensively using well-mastered circuit board technology, but the printed circuit board areas not covered by housing parts are exposed to aggressive transmission fluid requiring new construction and connection concepts
Solution Approach 1:
The patent embeds the printed circuit board within a housing structure, nesting it inside a protective cavity. The housing completely encloses the printed circuit board, isolating it from transmission fluid while maintaining the cost benefits of using conventional PCB technology. This nesting approach protects vulnerable electrical connections without requiring expensive fluid-resistant PCB materials.
Solution Approach 2:
The housing acts as an intermediary barrier between the printed circuit board and the transmission fluid. By introducing this intermediate protective structure, the patent enables the use of inexpensive conventional PCBs while preventing direct contact with harmful transmission fluid, thus resolving the contradiction between manufacturing cost and fluid exposure resistance.
2Device complexity
If the transmission control circuit is integrated directly on the printed circuit board, then the module structure is simplified, but the electrical connections and components are exposed to transmission fluid and metal chips
Solution Approach 1:
The patent nests the printed circuit board with integrated control circuitry inside a protective housing cavity. This nesting structure maintains the simplicity of direct integration while adding a protective layer that shields the electrical connections and components from transmission fluid and metal chips, thus improving reliability without significantly increasing device complexity.
Solution Approach 2:
The patent merges the printed circuit board and housing into a unified module structure where the board is embedded within the housing. This combination maintains structural simplicity while providing comprehensive protection, achieving both simplified device complexity and enhanced reliability through the integrated protective design.
3Reliability
If a carrier substrate separate from the printed circuit board is used for the transmission control circuit, then the circuit can be produced on a reliably mastered technology platform, but the integration of the carrier substrate with the printed circuit board requires new construction concepts
Solution Approach 1:
The patent nests the carrier substrate (such as LTCC or micro-PCB) within a housing cavity that also contains the printed circuit board. This nesting arrangement allows the use of reliably mastered carrier substrate technologies while integrating them into the module through a standardized embedding process, reducing the complexity of integration compared to alternative connection methods.
Solution Approach 2:
The housing serves as an intermediary structure that facilitates the integration of the carrier substrate with the printed circuit board system. By providing a common embedding environment, the housing simplifies the integration process and reduces the complexity of connecting separate substrate technologies.
4Volume of moving object
If electronic components are arranged with high population density on the carrier substrate, then the module dimensions can be kept compact, but the integration and sealing of the carrier substrate becomes more complex
Solution Approach 1:
The patent embeds the high-density carrier substrate within the housing cavity, allowing compact arrangement of electronic components. The nesting structure provides a standardized sealing approach that manages the complexity of integrating high-density components, as the housing encapsulation handles the sealing requirements uniformly regardless of component density.
Solution Approach 2:
The housing acts as a flexible sealing shell that adapts to the high-density component arrangement on the carrier substrate. This shell structure provides uniform protection and sealing without requiring complex integration schemes, managing the complexity while enabling compact high-density packaging.
Data Source
Figure 1
Figure 2
AI summary
The invention relates to a transmission control module (1) comprising a printed circuit board (2) which is at least partially accessible from the outside, can be exposed to transmission fluid and has conductor tracks (41, 42, 43) which are routed on at least one layer of the printed circuit board (2) and are intended to electrically connect a carrier substrate (3) of an electronic transmission control circuit to electrical/electronic components (7, 8) which are arranged outside the carrier substrate (3) on the printed circuit board (2), wherein the printed circuit board has at least one inner conductor track layer (26) which is arranged as an intermediate layer between two insulating layers (23, 24) of the printed circuit board (2). It is proposed that a first outer insulating layer (23) is provided, at least on a first side (21) of the printed circuit board (2), with a recess (5), at the bottom of which at least surfaces of conductor track sections (41a, 42a) of conductor tracks (41, 42) of the at least one inner conductor track layer (26) are arranged, that the carrier substrate (3) is inserted into the recess (5) from the first side of the printed circuit board (2) and makes electrical contact with the surfaces of the conductor track sections (41a, 42a) of the inner conductor track layer (26), and that the recess (5) is filled with a moulding compound (6), which covers at least the carrier substrate (3) and the conductor track sections (41a, 42a), in such a manner that the carrier substrate (3) and the conductor track sections (41a, 42a) are protected from transmission fluid by the moulding compound (6).