Transmission Line Via Layout for Impedance and Bendability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing transmission lines on substrates face impedance mismatch and signal transmission loss due to electromagnetic field disturbances when connecting electronic components, which also hinder bendability and require numerous interlayer connection conductors, increasing man-hours and complexity.
Innovation Solution
A transmission line design with strategically placed interlayer connection conductors, including third and fourth interlayer connection conductors, that reduce electromagnetic field radiation and impedance mismatch, ensuring bendability while minimizing the number of necessary conductors, by optimizing conductor placement and distance to match signal wavelength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If interlayer connection conductors are provided to connect upper and lower ground conductors, then electromagnetic field disturbance is suppressed, but the number of interlayer connection conductors increases and man-hours increase
Solution Approach 1:
The patent extracts the essential function of suppressing electromagnetic field disturbance by selectively removing unnecessary interlayer connection conductors. Specifically, interlayer connection conductors are omitted in regions where signal conductors are present, while retaining them only in necessary regions (such as regions without signal conductors or where ground potential stabilization is needed), thereby reducing the total number of conductors while maintaining electromagnetic field control.
Solution Approach 2:
The patent applies local quality by differentiating the configuration of interlayer connection conductors across different regions of the substrate. In regions with signal conductors, interlayer connection conductors are reduced or omitted to minimize interference. In regions without signal conductors or where ground stabilization is needed, interlayer connection conductors are retained. This regional differentiation optimizes the balance between electromagnetic field control and conductor reduction.
2Reliability
If interlayer connection conductors are provided to suppress electromagnetic field disturbance, then signal transmission quality improves, but manufacturing complexity and man-hours increase
Solution Approach 1:
The patent extracts unnecessary interlayer connection conductors from the structure, retaining them only where essential for signal transmission quality. By removing conductors in regions where they are not needed (such as under signal conductors), the manufacturing process is simplified while maintaining reliable signal transmission in critical areas.
Solution Approach 2:
The patent implements local quality by applying different conductor configurations to different regions: full interlayer connection in regions requiring ground stabilization, reduced or no connection in signal-rich regions. This localized approach maintains signal transmission quality where needed while reducing overall manufacturing complexity.
3Adaptability or versatility
If transmission line is bent after connection to circuit board, then adaptability improves, but interlayer connection conductors hinder bendability
Solution Approach 1:
The patent extracts interlayer connection conductors from regions where they would hinder bendability, specifically in areas where the transmission line may need to be bent after circuit board connection. This removal enables the transmission line to be bent without the constraint of numerous interlayer connection conductors, while retaining conductors in regions where structural integrity is needed.
Solution Approach 2:
The patent applies local quality by creating regions with different conductor densities: areas with fewer or no interlayer connection conductors to allow bending and adaptability, and areas with full conductor coverage to maintain structural integrity and electromagnetic field control where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces impedance mismatch, signal loss, and electromagnetic field disturbances, while maintaining bendability and reducing the number of interlayer connection conductors, thus improving efficiency and reducing man-hours.
Implementation Method 1
a first interlayer connection conductor, a second interlayer connection conductor, a third interlayer connection conductor, and a fourth interlayer connection conductor in the substrate. The first interlayer connection conductor connects the first signal conductor and the first mounting electrode, the second interlayer connection conductor connects the second signal conductor and the second mounting electrode
Implementation Method 2
When one end of a signal conductor formed in a substrate is connected to an electronic component mounting terminal on a surface of the substrate via an interlayer connection conductor, an electromagnetic field is disturbed around the interlayer connection conductor
Data Source
AI summary
A transmission line includes a first interlayer connection conductor connecting a first signal conductor and a first mounting electrode, a second interlayer connection conductor connecting a second signal conductor and a second mounting electrode, a third and fourth interlayer connection conductors respectively including third and fourth interlayer connection conductors, and each connecting first and second ground conductors between the first and second signal conductors. The third interlayer connection conductor is closer to the first and second interlayer connection conductors than the fourth interlayer connection conductor is, an adjacent distance between two of the fourth interlayer connection conductors is greater than an adjacent distance between two of the third interlayer connection conductors, and the adjacent distance between the two fourth interlayer connection conductors is less than about ½ of a minimum wavelength of signals transmitted by the first signal conductor and the second signal conductor.


