Transmission Window Cooling for Semiconductor Drying Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In substrate processing, the miniaturization of semiconductors leads to pattern collapse and uneven drying due to surface tension and interval issues between patterns, causing water marks and pattern defects during the drying process.
Innovation Solution
A substrate processing apparatus with a cooling unit that uses a cooling fluid to cool the transmission window between the heating unit and the substrate, preventing overheating and ensuring uniform drying by controlling the temperature of the transmission window.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the heating unit repeatedly heats the substrate through the transmission window, then the substrate drying effectiveness is improved, but the transmission window temperature increases causing uneven drying and pattern collapse
Solution Approach 1:
A cooling unit is introduced as an intermediary component between the heating unit and the transmission window. This cooling unit actively manages the thermal state of the transmission window, preventing it from overheating during repeated substrate processing cycles, thereby maintaining drying uniformity while allowing continuous operation.
Solution Approach 2:
The system dynamically changes the thermal parameters of the transmission window by introducing active cooling. This allows the transmission window temperature to be controlled within an optimal range, preventing the temperature buildup that causes uneven drying and pattern collapse while maintaining effective heating when needed.
2Reliability
If the transmission window is disposed to protect the heating unit from processing solution, then the heating unit is protected, but the transmission window overheats causing water marks and pattern collapse
Solution Approach 1:
The cooling unit serves as a protective intermediary that manages the thermal load on the transmission window. This allows the transmission window to fulfill its protective function while preventing the harmful thermal effects that would otherwise cause water marks and pattern collapse on the substrate.
Solution Approach 2:
The system converts the harmful heat accumulation in the transmission window into a controllable parameter by introducing active cooling. The cooling unit transforms the potential harm of repeated heating cycles into a beneficial controlled thermal management system, preventing defects while maintaining processing effectiveness.
3Productivity
If the substrate is carried into a dry processing chamber with a high temperature transmission window, then processing can continue, but uneven drying occurs causing water marks
Solution Approach 1:
The cooling unit performs preliminary cooling of the transmission window between processing cycles. This preliminary thermal management ensures that when the next substrate is carried into the chamber, the transmission window is at the appropriate temperature, preventing uneven drying and water marks while maintaining continuous productivity.
Solution Approach 2:
The system implements periodic cooling cycles of the transmission window between substrate processing operations. This periodic thermal management maintains the transmission window temperature within optimal ranges, ensuring drying uniformity across multiple substrates while sustaining high productivity through continuous operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents pattern collapse and water marks by maintaining a consistent substrate drying environment, improving the processing quality and reducing defects in semiconductor manufacturing.
Implementation Method 1
a transmission window which is provided to face the heating unit, and transmits the light emitted from the heating unit
Implementation Method 2
heating the substrate through a transmission window
Implementation Method 3
a cooling unit which cools down the transmission window using a cooling fluid
Implementation Method 4
cooling down the transmission window using a cooling fluid
Data Source
AI summary
The substrate processing unit 1 comprises the rotating table 31 configured to hold substrate W, the processing chamber 37 which accommodates the rotating table 31, a lamp 61 is provided above the processing chamber 37 and configured to heat the surface of substrate W, the lamp chamber 60 which accommodates that lamp 61, a transmission window 62 disposed below the lamp chamber 60, and a plurality of nozzle 64 which supply cooling fluid G to the transmission window 62. Then the substrate processing unit 1 can suppress generating of a water mark or pattern collapse, and can perform good substrate processing.