Transmissive BT LED Package Structure for Full-Angle Light Emission
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Solution Overview
Problem
Existing LED packaging structures have opaque lead frames that limit light emission to one side, requiring twice the number of chips for full illumination, increasing cost, and complex PCB wiring necessitates high manufacturing costs.
Innovation Solution
An integrated LED package structure using a light-transmissive BT plate and package colloid to allow light transmission from both sides, eliminating the need for PCBs and external control ICs, with direct connections via wires and self-controlled flashing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED chips are packaged on both sides of the lead frame to achieve full illumination, then light emission completeness is improved, but the number of LED chips required doubles, increasing cost
Solution Approach 1:
The patent applies the principle of changing optical properties by making the lead frame light-transmissive instead of opaque. This allows light to pass through the lead frame structure, enabling single-sided LED chips to illuminate both sides of the packaging, thereby achieving full illumination without doubling the number of chips required.
Solution Approach 2:
The patent transforms the traditional opaque lead frame into a light-transmissive structure, adding the dimension of light transmission capability. This dimensional change in the lead frame's optical property allows light to propagate through the structure, enabling illumination on both sides from single-sided LED chips.
2Reliability
If PCB with complex wiring is used to connect LED colored lamps, then electrical connections are achieved, but structural complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the functions of the PCB, control IC, and LED chip packaging into a single integrated structure. The lead frame simultaneously serves as the structural support, electrical connection pathway, and control circuit substrate, eliminating the need for separate PCB and external control IC components.
Solution Approach 2:
The lead frame is designed to perform multiple functions simultaneously: it provides structural support, establishes electrical connections between LED chips, and serves as the substrate for the control IC. This multi-functionality eliminates the need for separate dedicated PCB and control components, reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables comprehensive light emission, reduces production costs, simplifies structure and connections, and facilitates easy installation by eliminating PCB complexity and external ICs.
Implementation Method 1
The BT plate is made of a light-transmissive material
Implementation Method 2
excess energy is released through the recombination of carriers in a semiconductor to cause photon emission
Data Source
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AI summary
The present disclosure is applicable to the technical field of light emitting diode (LED) light sources, and provides an integrated LED package structure light source, including: a plurality of LED package structure bodies. The plurality of LED package structure bodies each include a BT plate, a positive-electrode terminal, a negative-electrode terminal, LED light-emitting chips, a control integrated circuit (IC), and a package colloid. The BT plate is made of a light-transmissive BT material. The BT plate made of the light-transmissive material and an LED chip packaged on one side of the BT plate allow light of the LED chip to be transmitted through the periphery and top end of the package colloid and the back side of the BT plate, thereby improving the light-emitting dead angle, achieving comprehensive light-emitting, reducing the production cost, improving the device practicability, facilitating port distribution rules, and achieving the structure and connection simplicity. Moreover, LEDs can be directly and quickly connected through connection wires, and the external control IC is not required anymore, thereby implementing the connection through a self-controlled flash method of the LED light source, and reducing the manufacturing cost.