Optically Transmissive Pick-Up Tool for UV Curing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In photonic system assembly, the curing of adhesives is hindered by the obstruction of metallic holding tools, leading to uncontrolled and non-uniform light distribution, which affects the accuracy and longevity of the assembly due to absorption, shadows, and stray light, causing potential curing issues and misalignment over time.
Innovation Solution
An optically transmissive pick-up tool with a rigid structure that transmits at least 50% of ultraviolet light and directs it at an angle of incidence less than 60 degrees onto the adhesive, ensuring uniform curing by using materials like glass or plastic, which reduces thermal expansion and maintains alignment precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If metallic holding tools are used to hold components during adhesive curing, then the components can be held in place with high accuracy, but the metallic tools obstruct the curing light and cause uncontrolled light distribution
Solution Approach 1:
The pick-up tool is made from a material with changed optical parameters - specifically, a material that is transparent to UV light rather than metallic and reflective. This parameter change allows the holding tool to no longer obstruct the curing light while maintaining its mechanical function of holding components with high accuracy during alignment and curing.
2Reliability
If high-intensity light sources are used to cure adhesives in tightly packed spaces, then curing can be achieved, but thermal expansion and stress increase affecting alignment precision
Solution Approach 1:
The transparent pick-up tool acts as an intermediary that transmits the curing light directly to the adhesive in tightly packed spaces. This eliminates the need for high-intensity light sources that would cause thermal expansion, as the light can reach the adhesive through the transparent holding tool without obstruction, enabling effective curing at lower intensities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances light throughput and uniformity, reducing curing time and stress, resulting in fully cured adhesives with improved temperature stability and extended component lifespan, minimizing the need for high-intensity light sources and reducing thermal expansion issues.
Implementation Method 1
The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light
Implementation Method 2
a reflective structure contacting the photonic component at a first surface and configured to reflect at least a portion of the ultraviolet light to the edge surface of the PIC
Implementation Method 3
providing at least a portion of at least one received beam of ultraviolet light to cure an adhesive between the edge surface of the photonic component and the edge surface of the PIC
Data Source
AI summary
An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.