Transmissive Substrate Alignment for Semiconductor Die Bonding
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Solution Overview
Problem
The existing fan-out type Wafer-Level-Packaging (WLP) methods face challenges in maintaining consistent intervals between semiconductor dies due to deviations in mechanical coordinates and thermal effects, leading to variations that hinder high integration and downsizing, and potentially result in defective semiconductor devices.
Innovation Solution
A method involving a transmissive substrate with alignment marks, where a camera images these marks to correct the positioning of a bonding head, ensuring precise pressure bonding of semiconductor dies onto the substrate, thereby eliminating interval variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor dies are pressure bonded based on mechanical coordinates of a linear encoder, then the bonding process can be performed, but deviation in bonding position occurs due to mechanical coordinate deviation and thermal effects, resulting in variation in intervals between semiconductor dies
Solution Approach 1:
The patent replaces the mechanical coordinate system (linear encoder) with an optical measurement system. A camera captures images of alignment marks on the temporary substrate to determine precise positions, substituting mechanical measurement with optical measurement to eliminate mechanical coordinate deviations and thermal expansion effects.
Solution Approach 2:
The patent introduces alignment marks as intermediary reference elements on the temporary substrate. These marks serve as mediators between the bonding head and the substrate, providing stable optical references that are not affected by mechanical coordinate systems or thermal expansion of the substrate itself.
2Manufacturing precision
If alignment marks are formed on the temporary substrate, then positioning can be improved, but interval variation still occurs due to thermal expansion of the temporary substrate
Solution Approach 1:
The patent changes the measurement parameter from mechanical coordinates to optical image coordinates. By capturing images with a camera and calculating positions based on alignment mark images, the system measures positions in the image plane rather than physical space, making the measurement independent of thermal expansion in the physical substrate.
Solution Approach 2:
The patent replaces physical measurement (affected by thermal expansion) with optical measurement. The camera system measures the positions of alignment marks through optical imaging, which is not affected by the thermal expansion of the temporary substrate, thereby maintaining measurement accuracy despite substrate dimensional changes.
3Manufacturing precision
If variation in intervals between semiconductor dies is reduced, then high integration and downsizing can be achieved, but requires more precise positioning control
Solution Approach 1:
The system uses the alignment marks on the temporary substrate to automatically determine bonding positions. The camera captures images of these marks, and the bonding head automatically adjusts its position based on the captured images, making the system self-correcting without requiring external intervention or complex pre-programming.
Solution Approach 2:
The patent implements a feedback mechanism where the camera continuously monitors the position of alignment marks, and this information is fed back to adjust the bonding head position. This closed-loop control ensures accurate positioning while maintaining relatively simple system architecture, as the feedback is based on direct optical measurement rather than complex calculations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for accurate and consistent placement of semiconductor dies, reducing defects and enabling higher integration and downsizing of semiconductor devices by eliminating the need for variation in wiring layer design.
Implementation Method 1
the transmissive substrate is transmissive to the alignment mark; an image acquisition process of imaging the alignment mark through the transmissive substrate from above the bonding stage with a camera
Implementation Method 2
a correction process of correcting a position in a horizontal direction of a bonding head, which pressure bonds a semiconductor die to the transmissive substrate
Data Source
AI summary
A method for manufacturing a semiconductor device and a mounting apparatus are provided. The method for manufacturing a semiconductor device includes: a placing step for placing, on a bonding surface, a temporary substrate which is transmissive with respect to an alignment mark; an image acquisition step for acquiring an image of the alignment mark and an image of a semiconductor die; a correction step for correcting, on the basis of the image of the alignment mark and the image of the semiconductor die acquired in the image acquisition step, the position in the horizontal direction of a bonding head that pressure bonds the semiconductor die to the temporary substrate; and a pressure bonding step for pressure bonding the semiconductor die to the transmissive substrate on the basis of the corrected position in the horizontal direction.