Transmissive Substrate LED with Conductive Via
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Solution Overview
Problem
Conventional light sources, such as fluorescent lamps and glow lamps, are inefficient in terms of power consumption, lifespan, response speed, and environmental friendliness, and existing LED technologies face challenges in maximizing light emission efficiency due to limitations in substrate materials and electrode connections.
Innovation Solution
A light emitting device with a transmissive substrate, an ohmic layer, and a conductive via that connects the light emitting structure to the electrode layer, utilizing materials like Al2O3, GaN, and ZnO for improved light emission efficiency through refractive index differences and surface roughness, and incorporating an adhesive layer for strong bonding and transparent metallic oxides for efficient power distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional light sources (fluorescent lamps, glow lamps) are used, then light emission is achieved, but power consumption is high and lifespan is short
Solution Approach 1:
The patent replaces conventional light sources (fluorescent lamps, glow lamps) with LED technology, substituting the mechanical/electromagnetic systems of traditional lighting with semiconductor-based electroluminescence. This substitution achieves lower power consumption and longer lifespan by utilizing the inherent efficiency of LED technology, which converts electrical energy directly to light with minimal energy loss.
2Loss of energy
If existing LED technologies are used, then light emission is achieved, but light emission efficiency is limited due to substrate material constraints
Solution Approach 1:
The patent changes the refractive index parameter of the substrate material to improve light emission efficiency. By selecting a substrate with a refractive index lower than that of the light emitting structure (such as sapphire, SiO2, or low-refractive-index polymers), the patent optimizes light extraction efficiency and reduces total internal reflection, thereby improving overall LED efficiency without significantly increasing device complexity.
3Power
If electrode connections are made through conventional methods, then electrical connection is achieved, but connection efficiency and power distribution are suboptimal
Solution Approach 1:
The patent introduces an adhesive layer as an intermediary between the substrate and the light emitting structure. This adhesive layer serves multiple functions: it provides mechanical bonding while also facilitating electrical connection and power distribution. The adhesive layer with appropriate electrical conductivity enables efficient power delivery to the light emitting structure without requiring complex electrode connection structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances light emission efficiency by allowing light to be emitted through the lateral surface of the transmissive substrate, improving power distribution and reducing lattice constant differences, resulting in a more efficient and environmentally friendly LED device.
Implementation Method 1
utilizing materials like Al2O3, GaN, and ZnO for improved light emission efficiency through refractive index differences
Implementation Method 2
a conductive via (131) to electrically connect the light emitting structure (145) with the electrode layer (132) through the transmissive substrate (110)
Implementation Method 3
a light emitting structure (145) formed above the ohmic layer (157) to generate light
Data Source
Figure 1~3
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Figure 6~7
AI summary
Disclosed is a light emitting device including a transmissive substrate (110), an ohmic layer (157) on the transmissive substrate, a light emitting structure (145) on the ohmic layer and including a first conductive semiconductor layer (130), a second conductive semiconductor layer (150), and an active layer (140) between the first and second semiconductor layers, an electrode layer (132) on a bottom surface of the transmissive substrate, and a conductive via (131) electrically connecting the light emitting structure with the electrode layer through the transmissive substrate wherein an area of the transmissive substrate is increased toward an upper portion thereof from a lower portion.