Transmit-and-Receive Module Grounding for Noise Isolation
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Solution Overview
Problem
In high-integration radio-frequency modules used in mobile communication terminals, a solid ground connection between power and low-noise amplifiers can lead to noise leakage, degrading the performance of these components when they are closely mounted on the same wiring substrate.
Innovation Solution
A transmit-and-receive module design featuring a wiring substrate with separate ground terminals for the power and low-noise amplifiers, where the low-noise amplifier's ground terminal is connected to a conductive shield and the power amplifier's ground terminal is connected to the motherboard substrate, reducing noise interference through increased isolation and flexible terminal design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solid ground (common ground) is used for both the power amplifier and the low-noise amplifier, then the grounding effect is reinforced, but noise leaks into these components via the solid ground, degrading their characteristics
Solution Approach 1:
The patent divides the common ground into separate ground terminals: a first ground terminal for the low-noise amplifier and a second ground terminal for the power amplifier. This segmentation prevents noise from the power amplifier from leaking into the low-noise amplifier through the ground path, while maintaining effective grounding for each component independently.
Solution Approach 2:
The patent introduces an insulating resin as an intermediary material between the first ground terminal and the second ground terminal. This insulating resin electrically isolates the two ground paths, preventing noise coupling while allowing the module to maintain compact integration.
2Productivity
If the power amplifier and low-noise amplifier are located close to each other on the same wiring substrate for high integration, then mounting density is improved, but noise influence on these components is increased
Solution Approach 1:
The patent segments the grounding system into separate first and second ground terminals positioned at different locations on the wiring substrate. This allows the power amplifier and low-noise amplifier to be mounted close together for high integration while maintaining independent ground paths that prevent noise interference between the closely spaced components.
Solution Approach 2:
The patent provides different grounding configurations for different components: the low-noise amplifier connects to the first ground terminal through an insulating resin for noise isolation, while the power amplifier connects to the second ground terminal for robust grounding. This local differentiation allows close proximity mounting without noise coupling.
3Object-affected harmful factors
If separate ground terminals are used for the power amplifier and low-noise amplifier, then noise leakage is reduced, but the complexity of the grounding structure increases
Solution Approach 1:
The insulating resin serves multiple functions: it provides electrical insulation between the first and second ground terminals, mechanically supports the ground terminals on the wiring substrate, and maintains the structural integrity of the module. This multi-functionality reduces the need for additional components, keeping the overall structure simple despite the separate ground terminals.
Data Source
AI summary
A transmit-and-receive module includes a wiring substrate, a low-noise amplifier, a power amplifier, an insulating resin, and a conductive shield. The wiring substrate has a first surface and a second surface which is a back side of the first surface. The low-noise amplifier includes a first signal terminal and a first ground terminal. The first signal terminal is surface-mounted on the first surface. The power amplifier includes a second signal terminal and a second ground terminal. The second signal terminal and the second ground terminal are surface-mounted on the first surface. The insulating resin covers the low-noise amplifier and the power amplifier. The conductive shield covers a surface of the insulating resin. The first ground terminal is connected to the conductive shield.