Semiconductor Package Layout With Transmitting Insulator for Circuit Isolation
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Solution Overview
Problem
Semiconductor devices with multiple elements in a single package face challenges in maintaining insulation withstand voltage due to differences in power supply voltages between conduction paths, leading to potential electrical insulation failures.
Innovation Solution
A semiconductor device design featuring conductive support members with distinct die pads and insulating elements, where the die pads have specific geometrical configurations and overlapping structures to enhance insulation, and a sealing resin that covers and insulates the elements, effectively managing the voltage differences and improving electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor elements are mounted in one package with different power supply voltages, then integration density is improved, but insulation withstand voltage between conduction paths deteriorates
Solution Approach 1:
The die pad is designed with an overlapping structure where the first die pad and second die pad overlap in the plan view. This spatial arrangement in another dimension (plan view overlap versus thickness direction separation) allows compact integration while maintaining insulation through the insulating element and sealing resin in the thickness direction.
Solution Approach 2:
An insulating element is introduced as an intermediary between the first semiconductor element and second semiconductor element. This insulating element has first and second surfaces that contact the semiconductor elements and side surfaces that extend toward the die pads, effectively mediating the insulation between conduction paths with different potentials.
Solution Approach 3:
The sealing resin is configured to specifically cover and insulate the die pads and insulating element in critical regions. The insulating property is locally enhanced at the die pad regions and interfaces where voltage differences exist, rather than uniformly throughout the entire package.
2Area of stationary object
If die pads are placed close together to reduce package size, then area is reduced, but electric field strength between die pads increases
Solution Approach 1:
The insulating element acts as a mediator between the first and second die pads, physically separating them and reducing direct electric field interaction. The side surfaces of the insulating element extend toward the die pads, creating additional insulation barriers that mitigate high electric field strength despite close spacing.
Solution Approach 2:
The geometric configuration of the die pads is changed to an overlapping structure, and the insulating element is designed with specific dimensions and positioning. These parameter changes optimize the balance between compact area and reduced electric field strength by controlling the spatial relationship and insulation thickness in critical regions.
3Reliability
If insulating element is added between circuits, then insulation withstand voltage is improved, but device complexity increases
Solution Approach 1:
The insulating element is merged with the die pad structure in the overlapping region, and the sealing resin simultaneously covers multiple components (die pads, insulating element, and semiconductor elements). This merging reduces the number of separate discrete parts and simplifies the overall assembly process.
Solution Approach 2:
The insulating element serves multiple functions: it provides electrical insulation between the first and second circuits, supports the semiconductor elements, and its side surfaces contribute to field shielding. The sealing resin simultaneously protects and insulates multiple components, reducing the need for separate protective structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly enhances the insulation withstand voltage between circuits, reducing electric field strength and improving dielectric strength, thereby preventing electrical failures and ensuring reliable operation.
Implementation Method 1
an insulating element that conducts to the first semiconductor element and the second semiconductor element and insulates the first circuit and the second circuit from each other
Implementation Method 2
a sealing resin that covers the first die pad, the second die pad, the first semiconductor element, the second semiconductor element, and the insulating element and insulates the first die pad and the second die pad from each other
Data Source
AI summary
A semiconductor device includes a conductive support member, a first semiconductor element, a second semiconductor element, an insulating element, and a sealing resin. The conductive support member includes a first die pad and a second die pad, which are separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. When viewed along a thickness direction, a peripheral edge of the first die pad has a first near-angle portion including a first end portion in a second direction orthogonal to both the thickness direction and the first direction. The first near-angle portion is separated from the second die pad in the first direction toward the first end portion in the second direction.