Transparent Adhesive LED Mounting with Piercing Protrusions
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Solution Overview
Problem
Conventional light-emitting devices face challenges with size restrictions due to the presence of golden wires, complex manufacturing processes, and reduced brightness and efficiency caused by opaque anisotropic conductive films and internal light reflection.
Innovation Solution
A light-emitting device featuring a multi-layer epitaxial structure with an insulated transparent adhesive layer and a light-pervious carrier, where protrusions on contact pads pierce the adhesive layer for electrical connection, enhancing mounting force and preventing light absorption, thereby improving brightness and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If golden wires are used for electrical connection, then electrical connection is achieved, but device size increases
Solution Approach 1:
The patent extracts and eliminates the golden wires from the device structure. Instead of using traditional wire bonding, the invention uses direct pad-to-pad electrical connection through the adhesive layer, removing the unnecessary volume occupied by wires and wire bonds while maintaining electrical connectivity.
Solution Approach 2:
The adhesive layer serves as an intermediary that provides both mechanical bonding and electrical connection functions. By incorporating conductive particles or traces within the adhesive layer, it mediates between the LED chip pads and the substrate pads, eliminating the need for separate wire bonding while achieving both mechanical and electrical connection.
2Strength
If opaque anisotropic conductive film is used for mounting, then mounting force is provided, but light emission is absorbed and efficiency decreases
Solution Approach 1:
The patent changes the optical property of the adhesive layer from opaque to transparent. By selecting transparent adhesive materials, the adhesive layer maintains its mechanical bonding function while allowing light to pass through without absorption, thus eliminating the energy loss associated with opaque materials.
Solution Approach 2:
The invention uses composite adhesive materials that combine transparent polymers with conductive particles (such as metal flakes, spheres, or wires). This composite structure provides both the mechanical strength needed for mounting and the electrical conductivity for signal transmission, while maintaining optical transparency to prevent light absorption.
3Strength
If solder bumps are used for mounting, then mounting force is provided, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the mounting function and electrical connection function into a single adhesive layer application step. Instead of separate processes for solder bump formation, mounting, and wire bonding, the invention combines these functions into one adhesive layer deposition and curing process, significantly simplifying the manufacturing workflow.
Solution Approach 2:
The adhesive layer with integrated conductive elements replaces expensive and complex solder bump structures. The adhesive material is generally less expensive than precision solder bumps and can be applied using simpler, more scalable processes such as screen printing, dispensing, or lamination, reducing both material and manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stronger mounting force and enhances light-emitting efficiency by preventing light absorption and internal reflection, addressing size and brightness issues in conventional devices.
Implementation Method 1
improving brightness and the light-emitting efficiency, for settling the problems in the known technology
Implementation Method 2
Because of the internal total reflection, a portion of the light is reflected to inside of the LED and the possibility of absorption by the active layer is increased
Implementation Method 3
At least one of the surfaces of the first contact pad and the third contact pad facing the insulated transparent adhesive layer has a first plurality of protrusions. The first plurality of protrusions pierces the insulated transparent adhesive layer to electrically connect the first contact pad to the third contact pad
Data Source
AI summary
A light-emitting device comprises a carrier, an insulated transparent adhesive layer, and a multi-layer epitaxial light-emitting structure located on the upper side of the insulated transparent adhesive layer. The top surface of the carrier comprises a first contact pad and a second contact pad. The insulated transparent adhesive layer is located on the upper side of the carrier, the first contact pad, and the second contact pad. The multi-layer epitaxial light-emitting structure comprises an active layer, a transparent layer located on the multi-layer epitaxial light-emitting structure, a third contact pad, and a fourth contact pad located on the multi-layer epitaxial light-emitting structure. At least one of surfaces of the first contact pad and the third contact pad facing the insulated transparent adhesive layer has a first plurality of protrusions. The first plurality of protrusions pierces the insulated transparent adhesive layer to electrically connect the first contact pad to the third contact pad. At least one of surfaces of the second contact pad and the fourth contact pad facing the insulated transparent adhesive layer has a second plurality of protrusions. The second plurality of protrusions pierces the insulated transparent adhesive layer to electrically connect the second contact pad to the fourth contact pad.